The SUSS Japan Seminar in 2012 has concluded.

Wafer bonding equipment suitable for various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components, from research and development to prototyping and small-scale production.

【Features】 - Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. - Accommodates wafers and substrates up to 200mm in diameter and stacking thicknesses up to 6mm. - Achieves high-precision post-bond alignment accuracy through the combination of a transport fixture with a clamping mechanism and the SUSS BA6/8 bond aligner. - Control of the bonding environment through vacuum or gas atmosphere control.

• Other processing machines

Fully automatic, compatible with a maximum of 200mm.

By docking our mask aligner module with the full-area exposure method, it can be used as the Ring Graphy Cluster LithoFab200.

• Other processing machines

Type up to 300mm - Spin Coating/Developing Cluster

Wafer-level packaging for mass production and 3D integration.

• Other processing machines

In applications where high-precision pressure measurement is required, it is necessary to select the optimal product from a wide range of options. Our extensive product lineup, consisting of pressure transducers, pressure transmitters, and digital pressure gauges, covers almost all application fields. So, what is the best solution for your needs? Before starting product selection, it is important to clearly define and organize the requirements. This will make product research more efficient and facilitate smoother communication. Generally, requirements can be classified into two categories: - Essential (Must) requirements - Desirable (Nice-to-have) requirements It can generally be said that having fewer essential requirements makes it easier to find solutions and helps keep costs and delivery times down. However, to define these requirements, it is first necessary to comprehensively analyze the fundamental issues. Only with this foundation can the analysis results be transformed into clear requirements for the desired product. This requires knowledge of the characteristics of the products being considered for purchase. For more information, please refer to the related links below!

JOHNAN DMS will exhibit at the "DocoDemo Festival OSAKA" held in Namba, showcasing our "paper substrate mounting." This is a valuable opportunity to directly experience cutting-edge technology. Please feel free to consult us about any concerns regarding paper substrate mounting. ■ Venue: Namba Square, Nansan Street ■ Free admission. We look forward to your visit. DocoDemo Festival OSAKA: https://www.osaka.cci.or.jp/ddfes/ For information about our paper substrate mounting services, please visit our website. https://www.johnan.com/dms/mounting/paper/

"There are gods who discard and gods who pick up." This was a phrase my father often used when we went to a model train shop that dealt in second-hand items. It is truly the case that gifts, which have continued to receive abnormally low evaluations even from antique dealers and recycling shops, have found their way to someone who genuinely wanted them, and it is indeed a joy, truly embodying the saying "there are gods who discard and gods who pick up." For more details, please see the link below. https://mbp-japan.com/hyogo/banyohkagaku/column/5215455/

[Duration: Ongoing until March 31, 2026] Let's preserve our "now" in form. Please feel free to inquire, whether it's for classes, clubs, school units, or even among friends.

【Period: Ongoing until March 31, 2026】 Increase your store's fans! We will create original goods that will capture hearts! Please feel free to contact us.