The SUSS Japan Seminar in 2012 has concluded.

Wafer bonding equipment suitable for various processes for diverse applications such as advanced MEMS, LEDs, and small electronic components, from research and development to prototyping and small-scale production.

【Features】 - Supports all wafer bonding processes including metal diffusion bonding, eutectic bonding, TLP bonding, adhesive bonding, fusion bonding, anodic bonding, and glass frit bonding. - Accommodates wafers and substrates up to 200mm in diameter and stacking thicknesses up to 6mm. - Achieves high-precision post-bond alignment accuracy through the combination of a transport fixture with a clamping mechanism and the SUSS BA6/8 bond aligner. - Control of the bonding environment through vacuum or gas atmosphere control.

• Other processing machines

Fully automatic, compatible with a maximum of 200mm.

By docking our mask aligner module with the full-area exposure method, it can be used as the Ring Graphy Cluster LithoFab200.

• Other processing machines

Type up to 300mm - Spin Coating/Developing Cluster

Wafer-level packaging for mass production and 3D integration.

• Other processing machines

The high-voltage fuse "EVFC-φ10.3 950V/1000V" is a heat-resistant and durable automotive high-voltage fuse (made of ceramic material) that supports DC 950V/1000V. It is utilized as a fuse for protecting high-voltage auxiliary circuits such as electric compressors and DC/DC converters. It is often adopted as an automotive fuse for high-voltage circuits that meet the needs of hybrid cars and electric vehicles. The EV fuse developed by PEC is not only used by domestic automotive manufacturers but has also been adopted by manufacturers worldwide, and it continues to be improved, becoming the global standard for fuses.

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Introducing a "non-destructive testing device as an alternative to the submerged test" for pharmaceutical packaging products. "Complete vial leak testing device | MSQ-2002 series" Fully automating leak tests for various vials, bottles, eye drops, and cylindrical containers. Please check the link below for videos and catalogs.

Fukuda's new flagship model. - Masterless type (FLA-0200 series) - General type (FLA-0201 series) Two models of air leak testers. With the mastering correction function, high-precision measurements can be achieved in a short time. Please take a look at the catalog.

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!