Added the heat-dissipating gap filler "TIA225GF" to AD-Chemi.
Momentive's "TIA225GF" is a two-component addition reaction type liquid silicone material for heat dissipation. The main agent (Component A) and the curing agent (Component B) are mixed in a weight ratio of 1:1 and cured by heating (70°C for 0.5 hours) or at room temperature (23°C for 24 hours). After curing, it becomes a rubber-like elastomer with a thermal conductivity of 2.5 W/(m·K), forming an excellent heat path.
This product is a liquid material with excellent thixotropic properties (shape retention), resulting in minimal dripping or smudging after application, making it easy to fill complex-shaped parts and gaps. It ensures stable thermal contact with high followability even on uneven bonding surfaces and narrow gaps, which are difficult to address with conventional thermal interface materials. By containing high-fill fillers, it achieves both high thermal conductivity and electrical insulation, making it suitable for applications requiring high reliability, such as power modules and communication boards.

Inquiry about this news
Contact Us OnlineMore Details & Registration
Details & Registration







