Silicone adhesive for silicone rubber (Momentive)

SILCOOLTIG1500 is a high-performance thermal grease developed based on the silicone material technology that Momentive has cultivated over many years, with a thermal conductivity of 1.5 W/m·K. As electronic devices become more compact and high-powered, thermal materials are required to simultaneously provide "long-term stability," "reduced thermal resistance," "workability," and "reliability." TIG1500 is a highly versatile thermal compound that meets these demands in a well-balanced manner and is adopted across a wide range of industrial fields. The product is a white paste that is easy to handle and supports various application methods such as dispensing, screen printing, and stamping. Official documentation states, "This product maintains its grease properties for a long time even under severe temperature conditions, minimizing weight loss during heating." In practice, the weight loss after heating at 150°C for 24 hours is only 0.08 wt%, which is extremely low, making it suitable for thermal management in electronic devices that require long-term reliability. For more details, please visit our website.

Momentive's "TSE382" is a one-component, oxime-based condensation RTV (Room Temperature Vulcanizing) silicone that reacts with moisture in the air to promote crosslinking reactions. In its uncured state, it is a low-viscosity paste, and after curing, it becomes an elastic rubber that forms a highly crosslinked siloxane network structure. Since it employs an oxime-based condensation reaction, it is a "neutral curing type" that does not release corrosive by-products such as acetic acid during the curing process. It exhibits high adhesion strength to aluminum, stainless steel, zinc die-cast, and various engineering plastics (such as ABS, PC, PBT, epoxy, etc.) without the need for surface treatment. In particular, due to the flexibility of the siloxane chains and their low surface energy, it spreads and wets the fine irregularities of the substrate surface, demonstrating a cohesive failure type of adhesion mode with high interfacial adhesion. For more details, please visit our website.

The Momentive product "TSE398" is a one-component, fast-curing, non-corrosive silicone adhesive sealant that cures with moisture in the air. After curing, it forms an elastic silicone rubber and exhibits excellent adhesion to copper, various metals, plastics, ceramics, glass, and more without the need for a primer. It has high fluidity and is designed for easy injection, making it widely applicable from waterproof sealing of electrical and electronic devices to general adhesive applications. - Non-corrosive: Complies with MIL-A-46146B corrosion testing. - Safe to use on highly corrosive metals such as copper and brass. - Fast curing: Tack-free time is only 10 minutes (at 23°C). - Low odor: Releases alcohol vapors during curing (significantly less odor compared to acetate-based products). - Primerless adhesion: Direct adhesion to a wide variety of substrates is possible. - Wide temperature range: Suitable for high and low temperature environments from -55°C to +200°C. - Excellent weather resistance, ozone resistance, and chemical resistance. - Outstanding electrical insulation properties: Ideal for sealing high-voltage components. - One-component formulation for easy handling. For more information, please visit our website.

Momentive's "TIA225GF" is a two-component addition reaction type liquid silicone material for heat dissipation. The main agent (Component A) and the curing agent (Component B) are mixed in a weight ratio of 1:1 and cured by heating (70°C for 0.5 hours) or at room temperature (23°C for 24 hours). After curing, it becomes a rubber-like elastomer with a thermal conductivity of 2.5 W/(m·K), forming an excellent heat path. This product is a liquid material with excellent thixotropic properties (shape retention), resulting in minimal dripping or smudging after application, making it easy to fill complex-shaped parts and gaps. It ensures stable thermal contact with high followability even on uneven bonding surfaces and narrow gaps, which are difficult to address with conventional thermal interface materials. By containing high-fill fillers, it achieves both high thermal conductivity and electrical insulation, making it suitable for applications requiring high reliability, such as power modules and communication boards.