Device dimensions: 1200W × 1100D × 2000H (200CBT) / 1500W × 1100D × 2000H (300CBT)
Set the substrate in the chuck manually, then perform paddle development, rinsing, and spin drying.
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basic information
【Features】 ■Device Dimensions 1200W×1100D×2000H (200CBT) 1500W×1100D×2000H (300CBT) ■Work Size Wafer φ4″ to φ8″ (300CBT max φ12″) Mask □4″ to □6″ (same max □9″) ■Options Chemical Supply Unit □For more details, please refer to the catalog.
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Company information
Kanamex Co., Ltd. has been engaged in the design and manufacturing of wet processing equipment related to photolithography in the semiconductor industry since its establishment. In today's electronics industry, particularly in the semiconductor front-end, advanced packaging technology, and FPD fields, there is an increasing demand for manufacturing processes that accommodate thinner, larger, and more advanced device substrates, as well as devices with higher functionalities, which require innovative manufacturing equipment. To meet the needs of the industry, our company is always alongside our customers, striving to improve customer satisfaction, maintaining a constant research and development mindset, and building innovative technologies to provide products and services that align with industry demands. We aim to conduct vibrant corporate activities as part of our management philosophy and will continue to work towards contributing to the development of society.
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