Up to 25 locations can be exposed with varying exposure conditions using open-frame exposure.
The UVES series photo process analysis exposure device is an exposure tool for research and development of photoresists. By performing step exposure, it allows for open-frame exposure with varying exposure conditions at up to 25 locations. By developing and analyzing the exposed samples using a resist development analyzer, it accelerates the material and process development of photoresists. Furthermore, by using the optional degassing collection unit, it enables component analysis of outgassing from the resist during exposure. For more details, please contact us or refer to the catalog.
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basic information
【Main Features】 ○ Compatible with g/h/i/248mm and broad light ○ Exposure area □ 10mm/25 shots □ 5mm/100 shots ○ Equipped with resist transmittance measurement function ○ Outgas collection and automatic transport 【Other Features】 ○ UVES-2000 (analysis exposure device compatible with g/h/i/248nm and broad light) → Equipped with a high-pressure mercury lamp, it can extract light at 436, 405, 365, and 248nm through filters for exposure. ○ UVES-2500 (resist sensitivity evaluation exposure device compatible with g/h/i/248nm and broad light) → An automatic machine with loader-unloader and robot transport functions added to the UVES-2000. ● For more details, please contact us or refer to the catalog.
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Applications/Examples of results
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Company information
Riso Tech Japan, since its establishment, has been a specialist in lithography, providing not only resist exposure/development analysis equipment, resist coaters/developers, and lithography simulators, but also evaluation of exposure/development materials for cutting-edge lithography processes. In particular, for resist processing equipment, we propose optimal specifications tailored to customer needs, adapting spin coaters, developers, bake (PEB) equipment, and film thickness measurement to various fields, ranging from development experimental equipment to fully automated production systems. For example, we offer coating equipment for various substrates such as ultra-thin silicon wafers, various compound semiconductors, quartz, sapphire, and piezoelectric substrates (SAW), including ArF resist, EB resist, high-viscosity thick-film resist, polyimide, insulating films, and wax, as well as development equipment for alkaline, inorganic, and organic materials. Additionally, we provide various process units such as HMDS treatment, vacuum bake, UV irradiation, and high-temperature bake processing.
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