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  1. Home
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  3. Control and Electrical Equipment
  4. Process Control Equipment
  5. Other process controls
  6. Photo Process Analysis Exposure Device ES-3500LP

Photo Process Analysis Exposure Device ES-3500LP

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last updated:Aug 31, 2022

リソテックジャパン
リソテックジャパン
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Equipped with an excimer lamp manufactured by Ushio Electric. A 193nm compatible analytical exposure device.

The photo process analysis exposure device ES-3500LP is equipped with a Ushio Electric Co., Ltd. excimer lamp instead of the laser light source used in the VUVES-4500. It does not require a large gas supply system like a laser light source, allowing for installation in various locations. For more details, please contact us or refer to the catalog.

    Spectroscopic Analysis EquipmentOther process controls
ArFES-3500LP.jpg

Photo Process Analysis Exposure Device ES-3500LP

ArFES-3500LP.jpg
ArFES-3500LP.jpg
  • Related Link - http://www.ltj.co.jp/SOL_html/sol_photo.html

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basic information

【Main Features】 ○ Compatible with g/h/i/248mm and broad light ○ Exposure area □10mm/25 shots         □5mm/100 shots ○ Equipped with resist transmittance measurement function ○ Outgas collection and automatic transport 【Other Features】 ○ Device equipped with an excimer lamp from Ushio Electric Co., Ltd. ○ Can be installed anywhere without the need for a large gas supply system like a laser light source. ● For more details, please contact us or refer to the catalog.

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リソテックジャパン

リソテックジャパン

Electronic Components and Semiconductors

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Riso Tech Japan, since its establishment, has been a specialist in lithography, providing not only resist exposure/development analysis equipment, resist coaters/developers, and lithography simulators, but also evaluation of exposure/development materials for cutting-edge lithography processes. In particular, for resist processing equipment, we propose optimal specifications tailored to customer needs, adapting spin coaters, developers, bake (PEB) equipment, and film thickness measurement to various fields, ranging from development experimental equipment to fully automated production systems. For example, we offer coating equipment for various substrates such as ultra-thin silicon wafers, various compound semiconductors, quartz, sapphire, and piezoelectric substrates (SAW), including ArF resist, EB resist, high-viscosity thick-film resist, polyimide, insulating films, and wax, as well as development equipment for alkaline, inorganic, and organic materials. Additionally, we provide various process units such as HMDS treatment, vacuum bake, UV irradiation, and high-temperature bake processing.

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