A collection of technical materials that consolidates useful information for research and development related to MEMS, where technological development is advancing, is available for free!
MEMS, centered around photofabrication and micromachine technology, is expected to thrive in various application fields. We are pleased to announce the comprehensive release of a "Technical Data Collection" that includes numerous processing and application technologies. This collection is filled with information on essential technologies such as "photoetching," which is a fundamental technology in MEMS and display device substrates; "dicing processing," a technique for accurately cutting out circuits formed on silicon wafers into chips; and "bump formation," which is indispensable for various mounting technologies such as CSP, BGA, and flip chips. For more details, please contact us or refer to the catalog.
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basic information
【Published Content】 ○ Photo Etching ○ Film Formation Processing ○ Polishing Processing ○ Dicing Processing ○ Inorganic Color Filters ○ Various Laser Masks & Mirrors ○ Fine FPC Circuit Boards ○ Direct Plating on Polyimide Film ○ Bump Formation ○ TEG Chips ○ Sandblasting ● For more details, please contact us or refer to the catalog.
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Applications/Examples of results
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Company information
In the future, as represented by MEMS, the research and development department will become indispensable in this industry, where higher precision and greater refinement are increasingly required. Our company will assist with prototyping and development using the know-how we have cultivated over many years. We look forward to inquiries from all industries, not just in the fields of electronics and optics.
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