Loading and unloading of φ150 mm and φ125 mm silicon wafers.
This is a device for loading and unloading φ150 mm and φ125 mm silicon wafers into a lap processing machine. The wafers taken out are subjected to thickness measurement one at a time for each batch, and an OK/NG judgment on the finished thickness is made.
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We have received orders from the semiconductor industry.
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☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
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