Heat-resistant specification: Non-contact transport device "Float Chuck SAH type"
Float Chuck SAH Type
Bernoulli chuck for non-contact transfer of high-temperature workpieces.
This product is manufactured according to the usage environment temperature and chemical specifications. The quartz glass used in ultra-high temperature applications possesses numerous characteristics, such as high purity, resistance to heat and acid, and high mechanical strength. It has become possible to transport wafers non-contact in cleaning tanks, oxidation diffusion furnaces, etching devices, CVD devices, etc., in the semiconductor manufacturing process, as well as non-contact transport of glass molding lenses. Additionally, products are made to suit various environments, including aluminum, SUS, PEEK, and others. ◎ Features 1. Heat resistance up to 1000°C 2. Materials are selected based on the usage temperature environment. PTFE, PEEK, aluminum, SUS316, quartz, considering acidic, alkaline, and corrosive gases. ◎ Target Work 1. High-temperature wafers 2. Glass molded lenses and preforms 3. Compound semiconductor wafers 4. Glass substrates
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basic information
The non-contact transport device "Float Chuck SAH type" adopts a vertical gas jet method. This method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing friction losses of the gas flow within the cushion chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capability compared to conventional types. This results in improved holding stability, increased resistance to impact, and nearly halved gas consumption. It is a Bernoulli chuck with high efficiency and low gas consumption for non-contact transport devices. ◎ Features 1. Heat resistance up to 1000°C 2. Materials used according to the operating temperature environment: PTFE, PEEK, aluminum, SUS316, quartz, considering acidic, alkaline, and corrosive gases. ◎ Target Workpieces 1. High-temperature wafers 2. Glass molded lenses and preforms 3. Compound semiconductor wafers 4. Glass substrates
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Applications/Examples of results
◎Non-contact transport device for the following work 1. High-temperature wafers 2. Glass molded lenses / preforms 3. Compound semiconductor wafers 4. Glass substrates
Company information
Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.
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