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  6. Wire saw, high-purity α-type silicon carbide abrasive material for wrapping processing 'GC'

Wire saw, high-purity α-type silicon carbide abrasive material for wrapping processing 'GC'

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last updated:Jun 11, 2024

フジミインコーポレーテッド
フジミインコーポレーテッド
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Resistant to chemicals, it self-generates sharp grinding edges through crushing, demonstrating excellent polishing power!

"GC" is a green silicon carbide abrasive material that boasts high SiC purity. The hexagonal α-type crystals possess hardness second only to diamond and are also very stable chemically at room temperature. Therefore, they are not affected by chemicals, self-generate sharp cutting edges through fragmentation, and exhibit excellent polishing power. It is used not only for precision lapping and dicing of quartz and ferrite, as well as for wire saws for cutting Si ingots, but also as a wide range of polishing materials for processing hard metals, cutting tools, soft metals such as cast iron and copper alloys, and resins. Additionally, it is suitable as a material for ultra-fine precision grinding wheels. 【Features】 ■ Has hardness second only to diamond ■ Very stable chemically at room temperature ■ Exhibits semiconductor properties electrically ■ Good thermal conductivity and high-temperature resistance ■ Also used as a material for heat sinks (heat dissipation components) *For more details, please refer to the PDF document or feel free to contact us.

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Wire saw, high-purity α-type silicon carbide abrasive material for wrapping processing 'GC'

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Green silicon carbide abrasive material 'GC'

Green silicon carbide abrasive material 'GC'

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フジミインコーポレーテッド

フジミインコーポレーテッド

Electronic Components and Semiconductors

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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.

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