[Book] Development of High Thermal Conductivity Materials (No. 2001BOD)
2001BOD
Technical Specialty Book: For Further Improvement of Thermal Conductivity
- Filler compounding, structural control, molecular design, thermal conductivity evaluation - ◎ Compatibility with temperatures above 200°C ◎ Usage of nitride fillers ◎ Balancing "insulation" and "heat dissipation" ⇒ A comprehensive overview of the latest technologies for next-generation power devices, LEDs, and automotive electronics! --- ■ Structure of this document ◆ Handling of high thermal conductivity fillers and compounding technology with resins ◆ - Detailed explanation of thermal conductivity and functional characteristics of various high thermal conductivity fillers - Dispersion control and stabilization technology for high thermal conductivity fillers - Orientation control technology for fillers and its effects - - - ◆ Development of high thermal conductivity resins for next-generation devices such as power semiconductors ◆ - Temperature characteristics when using power semiconductors and LEDs - What are the characteristics of nitride fillers, which are attracting attention as high thermal conductivity fillers? - - ◆ Methods and points for measuring thermal conductivity ◆ - How to use thermal conductivity measurement devices and key points - Measurement of thermal diffusion and thermal conductivity of thermal interface materials - Flash method, quasi-steady method, distance change method, frequency change method... - - -
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■Table of Contents Chapter 1 Mechanisms of Thermal Conductivity in Polymers Chapter 2 Properties of Thermally Conductive Fillers Chapter 3 Techniques for Compounding, Dispersion, and Orientation Control of Fillers Chapter 4 Electrochemical Measurement and Analysis of Solar Cells Chapter 5 Enhancing Thermal Conductivity of Resins through Structural Control and Molecular Design Chapter 6 Thermal Expansion Control Techniques for Resin Materials Chapter 7 Development of High Thermal Conductivity Elastomers and Carbon Materials Chapter 8 Development of High Thermal Conductivity Resin Materials Required for Power Semiconductors, Automotive Electronics, and LEDs Chapter 9 Design of Heat Dissipation Implementation and Structures for Power Semiconductors, Automotive Electronics, and LEDs Chapter 10 Evaluation and Analysis Techniques for the Thermal Conductivity Properties of Heat Dissipation Materials －－－－－－－－－－－－－－－－－－－－－－－－－－ ●Publication Date: July 31, 2019 ●Authors: 60 individuals ●Format: A4 size, 524 pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-754-1 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available Price: 44,000 yen (tax included) ISBN: 978-4-86798-006-4 After receiving your order, we will perform simple printing and binding. －－－－－－－－－－－－－－－－－－－－－－－－－－
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44,000 yen (tax included) [shipping included]
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