Versatile bonder with a variety of options! It is a universal bonder capable of performing wire bonding and pull/share tests.
The "MODEL56xx series" is a versatile bonder that can automatically perform wire bonding and pull/share tests, despite being a tabletop model. It is suitable for users who find bonding difficult with manual machines and do not require the production volume of fully automatic machines. Various optional features, such as automatic recognition and monitoring of wire deformation during bonding, can be easily added. 【Features】 ■ Diverse functions (6 in 1 Unit all-in-one) ■ User-friendly software ■ High flexibility ■ Wide work area ■ Various optional features *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
[Various Bond Heads that can be Mounted and Replaced] ■5610 Ball Bonder ■5630 Fine Wire Wedge Bonder ■5632 Deep Access Wedge Bonder ■5650 Thick Wire Bonder ■5650HR Thick Ribbon Bonder ■5600C Semi-Automatic Multi-Tester (Pull/Shear Tester)
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Applications/Examples of results
Line up（6）
| Model number | overview |
|---|---|
| MODEL5610 | Ball Bonder |
| MODEL5630 | Fine Wire Wedge Bonder |
| MODEL5632 | Deep Access Wedge Bonder |
| MODEL5650 | Thick Wire Wedge Bonder |
| MODEL5650HR | Thick Wire Ribbon Bonder |
| MODEL5600C | Semi-Automatic Multi Bond Tester (Pull/Shear Tester) |
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Company information
At Eltech Co., Ltd., we provide semiconductor manufacturing equipment utilizing cutting-edge technology, including wire bonders, ultrasonic oscillators, and bonding tools. We offer a range of products starting with the tabletop semi-automatic wire bonder "MODEL 56i series," as well as the MODEL 53 series manual wire bonder for research and development/small-scale production purposes, and the M17 automatic wire bonder for production applications. Please feel free to contact us if you have any inquiries.