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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Bonding Equipment
  6. Semi-Automatic Wire Bonder 'MODEL 56xx Series'

Semi-Automatic Wire Bonder 'MODEL 56xx Series'

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last updated:Feb 20, 2020

エルテック
エルテック
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Versatile bonder with a variety of options! It is a universal bonder capable of performing wire bonding and pull/share tests.

The "MODEL56xx series" is a versatile bonder that can automatically perform wire bonding and pull/share tests, despite being a tabletop model. It is suitable for users who find bonding difficult with manual machines and do not require the production volume of fully automatic machines. Various optional features, such as automatic recognition and monitoring of wire deformation during bonding, can be easily added. 【Features】 ■ Diverse functions (6 in 1 Unit all-in-one) ■ User-friendly software ■ High flexibility ■ Wide work area ■ Various optional features *For more details, please refer to the PDF materials or feel free to contact us.

    Bonding Equipment
56xx_2e_01.jpg

Semi-Automatic Wire Bonder 'MODEL 56xx Series'

56xx_2e_01.jpg
56xx_2e_01.jpg
  • Related Link - http://eltech.co.jp/seihinannai/wirebonder/semiaut…

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basic information

[Various Bond Heads that can be Mounted and Replaced] ■5610 Ball Bonder ■5630 Fine Wire Wedge Bonder ■5632 Deep Access Wedge Bonder ■5650 Thick Wire Bonder ■5650HR Thick Ribbon Bonder ■5600C Semi-Automatic Multi-Tester (Pull/Shear Tester)

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Model number overview
MODEL5610 Ball Bonder
MODEL5630 Fine Wire Wedge Bonder
MODEL5632 Deep Access Wedge Bonder
MODEL5650 Thick Wire Wedge Bonder
MODEL5650HR Thick Wire Ribbon Bonder
MODEL5600C Semi-Automatic Multi Bond Tester (Pull/Shear Tester)

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Semi-Automatic Wire Bonder 'MODEL56xx Series'

Semi-Automatic Wire Bonder 'MODEL56xx Series'

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エルテック

エルテック

Electronic Components and Semiconductors

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At Eltech Co., Ltd., we provide semiconductor manufacturing equipment utilizing cutting-edge technology, including wire bonders, ultrasonic oscillators, and bonding tools. We offer a range of products starting with the tabletop semi-automatic wire bonder "MODEL 56i series," as well as the MODEL 53 series manual wire bonder for research and development/small-scale production purposes, and the M17 automatic wire bonder for production applications. Please feel free to contact us if you have any inquiries.

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