Next-generation power semiconductor module sintering (sintering) prototype and mass production equipment.
The sintering system "SIN200+" is a new bonding technology that replaces conventional Sn-based solder materials, capable of supporting applications from R&D prototype evaluation to mass production for die attach bonding through sintering of power semiconductor modules. It is particularly optimal for SiC power semiconductors. During the entire process of heating, sintering (pressurizing), and cooling within a vacuum chamber, the substrate temperature, ambient pressure, and process gas can be accurately controlled in real-time, and reduction using formic acid gas is also possible. Compared to traditional bonding under atmospheric pressure, the process, which varies pressure, pressurization, and gas injection in a timely manner, achieves a more uniform and highly reliable sintering bond. Additionally, the sintering materials can accommodate silver paste and copper paste, and a special pressurizing jig is employed, eliminating the need to change jigs even when the bonding height or size changes, thus providing rapid, flexible, and economical processing for a variety of products. There are already numerous delivery records to major power semiconductor manufacturers in Europe. *For more details, please refer to the PDF materials or feel free to contact us.*
Inquire About This Product
basic information
**Features** - Pressing pressure: up to 2,000 kN (200 tons) - Real-time control of programmed pressing conditions (automatic stroke adjustment) - Processing area: ≤ φ280 - Usable gas atmospheres (N2, N2/O2, N2/H2, HCOOH) - Compatible with silver paste and copper paste - Atmospheric pressure range: 1-1200 mbar - Temperature range: up to 350℃ - Integrated heating technology - Control and monitoring with programmable temperature profiles - Constant pressure control and traceability features - Easy operation using a touch screen - Built-in interface with MES (e.g., SECS/GEM) - Highly expandable modular design - Sealed process chamber - Automatic and manual product loading and unloading *For more details, please refer to the PDF document or feel free to contact us.*
Price range
Delivery Time
Applications/Examples of results
【Purpose】 ■ R&D prototype evaluation and mass production ■ Sintering bonding (silver paste, copper paste) *For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Advanced Global Alliance (AGA) is a premier sales and service provider for advanced technology related products. We serve in the fields of semiconductor, microelectronics, automotive and medical. Consistently we develop product source to meet new market demand, especially in the high-end industries. We are a team with more than 20 years of sales and service experience in serving various enterprises including MNCs. In today’s advanced manufacturing environment, it is ever necessary for companies to integrate their products to create innovative solutions and to present the best overall standards for customers. In order to achieve this, we source globally such companies and form a synergized alliance to meet the demand of the market.
![Deburring Machine "Twin Baritor" [Eligible for Small and Medium Enterprise Productivity Investment Subsidy]](https://image.mono.ipros.com/public/product/image/6d3/2000308654/IPROS16685940644635288329.png?w=280&h=280)
![[Semiconductor/Class 100 Compatible] 100% Water-Free Air Nozzle](https://image.mono.ipros.com/public/product/image/2116982/IPROS15202438644694791694.png?w=280&h=280)
