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  5. Resist Device
  6. Semi-automatic photoresist developing equipment (semi-auto developer)

Semi-automatic photoresist developing equipment (semi-auto developer)

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last updated:Apr 04, 2023

エイ・エス・エイ・ピイ
エイ・エス・エイ・ピイ
  • Official site

It is a semi-automatic developer for customers who do not have a high enough production volume to purchase a fully automated machine but seek process reproducibility.

This product is equipped with a sheet-fed development, baking, and cooling unit. It is recommended for customers who have a production volume that is not high enough to introduce an automatic machine, but cannot adopt a manual machine due to labor issues! We design and manufacture semi-automatic machines tailored to your needs, so if you are having trouble introducing new equipment, please consider us! We have a proven track record with various chemicals such as TMAH. 【Features】 ■ Automatic transport function ■ Achieves low cost ■ Proven track record with various chemicals ■ Reduced footprint *Please feel free to contact us for more details.

    Resist Device
マニュアルコーター.jpg

Semi-automatic photoresist developing equipment (semi-auto developer)

マニュアルコーター.jpg
マニュアルコーター.jpg
  • Related Link - http://www.asap-semi.co.jp/coaters/

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basic information

【Main Specifications】 ■ Spin Development Unit: 1 set ■ Wafer Size: Φ2" to Φ12" ■ Development Nozzle: 1 set/CUP ■ Rinse Nozzle: 1 set/CUP ■ Bake Unit: 1 set (Max 200℃) ■ Cooling Unit: 1 set ■ Centering Unit: 1 set ■ Equipment Size: (Example) 1300×1450×1800 (Φ4" main body, power supply, and chemicals integrated) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.

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Delivery Time

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※3 to 4 months (usually), but it may vary depending on the situation, so please feel free to contact us.

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エイ・エス・エイ・ピイ

エイ・エス・エイ・ピイ

Electronic Components and Semiconductors

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We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.

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