It is a single-fluid developing device that is effective in reducing the development and processing time of thick films. You can freely choose the spray shape (circular, fan, etc.), pressure, and flow rate.
It is a single-fluid spray-type developing device. Since the spray is generated by the pressure of the developing solution, mist from the spray is less likely to scatter, and it can also speed up the developing process. It is optimal for developing large substrates and thick films. The spray nozzle can be freely selected in terms of shape (such as fan-shaped or circular), distribution, spreading angle, and range. This product is equipped with developing, baking, and cooling functions in a sheet-fed format. With a lineup tailored to production volume, ranging from manual machines to fully automatic machines, we have achieved low prices by handling everything from design to manufacturing and sales in-house. We have a proven track record with a variety of chemicals, including TMAH. 【Features】 ■ Equipped with single-fluid spray (can be used in conjunction with paddles) ■ Automatic wafer size recognition ■ Reduced footprint ■ Lineup tailored to production volume We have a demo setup available, so please consider scheduling a demonstration!
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basic information
**Main Specifications** - Cassette Stage: 2 sets - Spin Development Unit: 2 sets - Wafer Size: Φ2" to Φ12" - Development Nozzle: 1 set/CUP - Rinse Nozzle: 1 set/CUP - Bake Unit: 2 sets (Max 200℃) - Cooling Unit: 1 set - Centering Unit: 1 set - Equipment Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) - Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.*
Price range
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
We have a track record of sales in the fields of power devices, SAW filters, and communications.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.