Compatible with low to high viscosity resists! We can manufacture equipment for any wafer size, from small diameter to large diameter!
【Features】 ■ Achieves low price ■ Supports low to high viscosity (1.7cP to 10000cP) ■ Compatible with sizes from 2 to 12 inches ■ Capable of processing multiple wafer sizes (e.g., compatible with 3, 4, 5 inches and 8, 12 inches) ■ Automatic wafer size recognition system ■ Proven performance with a variety of chemicals ■ Reduced footprint (space-saving) ■ Numerous options available with resist reduction ■ Lineup tailored to production volume 【ASAP Coater/Developer Functions】 ● Spin coating ● HMDS treatment ● Baking ● Cooling ● Developing ● Rinsing We have achieved low prices by handling everything from design to manufacturing and sales in-house! 【ASAP Features and Achievements】 ● Proven use of a variety of chemicals including positive and negative resists, polyimide, SOG, WAX, silicone, etc. ● Extensive experience in substrate transport including Si (silicon), GaAs, InP, GaN, SiC, sapphire, ceramics, SiO2 (glass), etc. ● Numerous transport achievements with thin substrates such as GaAs (thickness 150um), InP (thickness 150um), LT (thickness 120um)! *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Main Specifications】 ■ Cassette Stage: 2 sets ■ Spin Coating Unit: 1 set ■ Spin Development Unit: 1 set ■ Wafer Size: Φ2" to Φ12" ■ Resist Dropping Nozzle: 1 set ■ Back Edge Rinse: 1 set / Coating CUP ■ Development Nozzle: 1 set ■ Rinse Nozzle: 1 set ■ Bake Unit: 3 sets (Max 200℃) ■ Cooling Unit: 1 set ■ Centering Unit: 1 set ■ Equipment Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) ■ Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
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