It can be easily used by anyone simply by specifying the etching amount (depth) and the material of the wafer.
The "BEM-301" is a device that uses ozone and vaporized fluorine for etching. Etching is performed while monitoring the etching amount, allowing for high-precision etching. Additionally, accurate etching can be achieved even from the first piece. 【Specifications】 ■ Etching rate: 2μm/H or more ■ Flatness: within 10% ■ Accuracy of etching amount (depth): within ±5% ■ Utilities: O2, N2, HF, DIW, cooling water, AC-100V, AC-200V, acid exhaust, acid wastewater ■ External dimensions: 1,000W × 1,300D × 2,000H (mm) ■ Weight: approximately 300Kg *For more details, please download the PDF or contact us.
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Our company has responded to various needs by utilizing surface contamination recovery devices. With technology that has made it possible to recover contamination from hydrophilic surfaces, which was previously thought to be impossible, we will help solve your concerns. Please feel free to contact us if you have any requests.