Observation of cross-sectional processing of CCD camera module.

I would like to introduce "Cross-sectional observation of tracking camera using mechanical polishing." Regarding the structure of the tracking camera components, when viewed from above, the lens can be identified. Although it cannot be clearly seen in the X-ray image, the lens is incorporated into the convex part. Additionally, the cross-sectional structure is similar to that of an RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is not necessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode.

At our company, we created a cross-section of the CMOS image sensor component associated with A company's VR goggles through mechanical polishing while keeping the component intact, and we conducted structural observations of the CMOS sensor component. During the observation of the sensor component structure and sensor surface, we removed the glass filter and observed the CMOS sensor surface, where it was noted that the arrangement of the color filters was in a configuration known as a Bayer filter. In addition to mechanical polishing, methods for creating cross-sections include processing with ion beams such as FIB and CP, as well as microtome methods. Consultations are free, so please feel free to contact us if you are unsure about the cross-section creation method.

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structure of the components with a metal microscope. The observation modes of the metal microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks.

We will introduce examples of cross-sectional observations of various components mounted on a board called an organic substrate. Inside various electronic devices around us, there are substrates equipped with electronic components. When observing the mounted substrate, you can see that numerous components are tightly soldered together. It is necessary to verify that these components are properly joined, as they will not function correctly otherwise. Please contact us if you are considering observations before and after reliability testing or cross-sectional observations.