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  4. Observation of CMOS image sensor cross-section by mechanical polishing.
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  • Feb 28, 2025
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Feb 28, 2025

Observation of CMOS image sensor cross-section by mechanical polishing.

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At our company, we created a cross-section of the CMOS image sensor component associated with A company's VR goggles through mechanical polishing while keeping the component intact, and we conducted structural observations of the CMOS sensor component. During the observation of the sensor component structure and sensor surface, we removed the glass filter and observed the CMOS sensor surface, where it was noted that the arrangement of the color filters was in a configuration known as a Bayer filter. In addition to mechanical polishing, methods for creating cross-sections include processing with ion beams such as FIB and CP, as well as microtome methods. Consultations are free, so please feel free to contact us if you are unsure about the cross-section creation method.
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Observation of CMOS image sensor cross-section by mechanical polishing.

Due to the advantages and disadvantages, it is necessary to choose according to the sample form, observation range, purpose, etc.!

At our company, we created a cross-section of the CMOS image sensor component associated with VR goggles manufactured by Company A through mechanical polishing while keeping the component in its original state, and we conducted structural observations of the CMOS sensor component. During the observation of the sensor component structure and sensor surface, we removed the glass filter and observed the surface of the CMOS sensor, where it was noted that the arrangement of the color filters was in a configuration known as a Bayer filter. In addition to mechanical polishing, methods for creating cross-sections include processing with ion beams such as FIB and CP, as well as microtome methods. Consultations are free, so please feel free to contact us if you are unsure about the method for creating cross-sections. [Overview] ■ Observation of sensor component structure and sensor surface ■ Cross-section creation by mechanical polishing ■ SEM observation of the sensor chip surface layer *For more details, please download the PDF or feel free to contact us.

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Total support service for cross-sectional grinding, processing, observation, and analysis.

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake contract processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observation and analysis of the produced cross-sections, providing contract analysis for defect analysis and quality evaluation. 【Service List】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Cross-sectional polishing service for implementation parts and electronic components.

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implemented components and electronic parts." To quickly provide suitable cross-section samples for the observation of various components, we carefully polish each part by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly providing suitable cross-section samples for the observation of various components ■ Carefully polishing each part by hand, using an efficient process without waste *For more details, please refer to the PDF document or feel free to contact us.

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Surface mount electronic component cross-sectional observation service

You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!

Our company conducts "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks and voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, while for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

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Observation of cross-sectional processing of CCD camera module.

With our advanced technology, we can also create cross-sections of highly challenging samples!

The CCD camera module is composed of a complex structure that integrates electronic and mechanical technologies, including sensors, control elements, and AF drive mechanisms, all within a small housing. Additionally, a variety of materials such as metal, glass, and resin are used, making cross-section preparation difficult. Our company can produce cross-sections of such high-difficulty samples with advanced technology. 【Cross-section of CCD Camera Module】 ■ Multiple lenses and filters are built into the small housing ■ Products with AF functionality also incorporate mechanisms for focus adjustment and control elements *For more details, please refer to the PDF document or feel free to contact us.

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Cross-sectional observation of substrate-mounted components (1) to (6)

Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metallurgical microscope. The observation modes of the metallurgical microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metallurgical microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Examples of semiconductor observation through mechanical polishing.

Cross-section preparation for structural observation and defect analysis of semiconductors! Cross-section preparation comparable to FIB and CP is possible.

We would like to introduce an example of "observation of semiconductors through mechanical polishing" conducted by our company. While there are advantages and disadvantages, it is possible to create cross-sections with mechanical polishing that are comparable to those produced by FIB or CP. Based on years of accumulated know-how, our company will propose the most appropriate processing methods according to the observation purpose, sample composition, and structure. If you have any concerns, please feel free to contact us at the information below. 【Observation Examples】 ■ Semiconductor_Si ■ Compound Semiconductor_GaN ■ Compound Semiconductor_GaP ■ Compound Semiconductor_GaAs *For more details, please refer to the PDF materials or feel free to contact us.

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Related catalog(7)

Observation of CMOS image sensor cross-section by mechanical polishing.

Observation of CMOS image sensor cross-section by mechanical polishing.

TECHNICAL
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Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

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Cross-sectional polishing service for implementation parts and electronic components.

Cross-sectional polishing service for implementation parts and electronic components.

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Surface mount electronic component cross-sectional observation service

Surface mount electronic component cross-sectional observation service

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Observation of cross-section processing of CCD camera module.

Observation of cross-section processing of CCD camera module.

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Cross-sectional observation of substrate-mounted components (1) to (6)

Cross-sectional observation of substrate-mounted components (1) to (6)

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Examples of semiconductor observation through mechanical polishing.

Examples of semiconductor observation through mechanical polishing.

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Hyper CLT flooring panel

Wooden flooring that supports the ease of walking for workers | Hyper CLT flooring

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In civil engineering sites, workers stand for long periods and move around the site multiple times. Muddy and uneven ground makes walking difficult, leading to strain on the feet and back, as well as an increased risk of falls, so ensuring a stable work path is important. Hyper CLT mats are civil engineering CLT materials that utilize laminated CLT wood. By laying them down in areas such as temporary roads, material storage sites, assembly areas, break areas, and worker pathways, they help reduce unevenness and mud, creating a more walkable environment. They possess surface characteristics unique to wood, providing a walking environment that differs from metal plates. The 5×10 panel weighs about 230 kg, and the 5×20 panel weighs about 460 kg, making them lightweight and easy to handle even with small machinery, which helps reduce the burden of installation and removal. Additionally, they can be used to address environmental concerns such as glare reduction, noise reduction, and CO2 fixation, as well as measures against heatstroke. They are recommended for creating worker-friendly sites and innovative public works as a registered technology with the Ministry of Land, Infrastructure, Transport and Tourism under NETIS "TH-250021-A."

Aug 08, 2026

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Please take a look at the technical document for the leak test, the "Technical Manual"!

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Fukuda Co., Ltd., which develops, manufactures, and sells leak testing equipment to inspect airtightness and sealing performance, provides a technical document that clearly explains the methods and theories of airtight testing, titled "Technical Manual." We are offering it as a PDF file. Please take this opportunity to download and view it!

Aug 07, 2026

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Fukuda's leak test, leak inspection, leak detection, leak test, integrity test.

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Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Aug 07, 2026

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Hyper CLT flooring panel

Wooden CLT flooring for foot protection during rainy weather | Hyper CLT flooring

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In civil engineering sites, due to the effects of rain and mud, temporary roads, access routes, and heavy machinery work yards can become slippery. To ensure the safety of vehicles and workers, it is important to choose appropriate mats for the site conditions and to improve the footing environment. Hyper CLT mats are civil engineering CLT materials that utilize laminated timber. They possess surface characteristics unique to wood and can provide a non-slip footing environment that differs from metal steel plates. They can be used in a wide range of civil engineering sites, including temporary roads, vehicle entrances and exits, mud prevention, ground protection, heavy machinery scaffolding, and worker pathways. The 5×10 panel weighs approximately 230 kg, and the 5×20 panel weighs about 460 kg, making them lightweight and easy to handle even with small machinery, which contributes to labor-saving in installation and removal. It should be noted that slipperiness can vary depending on weather, slope, mud or oil adhesion, and installation conditions, so on-site verification and appropriate maintenance management are necessary. This wooden mat is registered as a technology with the Ministry of Land, Infrastructure, Transport and Tourism under NETIS as "TH-250021-A" and can be utilized for safety measures and creative ideas.

Aug 07, 2026

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Please let us know your concerns regarding leaks. We may have some suggestions for you. Leak tests, leakage tests, leak inspections, leak detection, container integrity tests, packaging integrity tests...

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Fukuda Corporation has been pursuing leak detection for 60 years and is dedicated to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing performance. We will propose suitable testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Aug 07, 2026

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