Observation of tracking camera cross-section by mechanical grinding.

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake contract processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observation and analysis of the produced cross-sections, providing contract analysis for defect analysis and quality evaluation. 【Service List】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implemented components and electronic parts." To quickly provide suitable cross-section samples for the observation of various components, we carefully polish each part by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly providing suitable cross-section samples for the observation of various components ■ Carefully polishing each part by hand, using an efficient process without waste *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Surface treatment contract service
• Other contract services

You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!

Our company conducts "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks and voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, while for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Inspection
• Other contract services

With our advanced technology, we can also create cross-sections of highly challenging samples!

The CCD camera module is composed of a complex structure that integrates electronic and mechanical technologies, including sensors, control elements, and AF drive mechanisms, all within a small housing. Additionally, a variety of materials such as metal, glass, and resin are used, making cross-section preparation difficult. Our company can produce cross-sections of such high-difficulty samples with advanced technology. 【Cross-section of CCD Camera Module】 ■ Multiple lenses and filters are built into the small housing ■ Products with AF functionality also incorporate mechanisms for focus adjustment and control elements *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Analysis Services

Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metallurgical microscope. The observation modes of the metallurgical microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metallurgical microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Cross-section preparation for structural observation and defect analysis of semiconductors! Cross-section preparation comparable to FIB and CP is possible.

We would like to introduce an example of "observation of semiconductors through mechanical polishing" conducted by our company. While there are advantages and disadvantages, it is possible to create cross-sections with mechanical polishing that are comparable to those produced by FIB or CP. Based on years of accumulated know-how, our company will propose the most appropriate processing methods according to the observation purpose, sample composition, and structure. If you have any concerns, please feel free to contact us at the information below. 【Observation Examples】 ■ Semiconductor_Si ■ Compound Semiconductor_GaN ■ Compound Semiconductor_GaP ■ Compound Semiconductor_GaAs *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer processing/polishing equipment

Due to the advantages and disadvantages, it is necessary to choose according to the sample form, observation range, purpose, etc.!

At our company, we created a cross-section of the CMOS image sensor component associated with VR goggles manufactured by Company A through mechanical polishing while keeping the component in its original state, and we conducted structural observations of the CMOS sensor component. During the observation of the sensor component structure and sensor surface, we removed the glass filter and observed the surface of the CMOS sensor, where it was noted that the arrangement of the color filters was in a configuration known as a Bayer filter. In addition to mechanical polishing, methods for creating cross-sections include processing with ion beams such as FIB and CP, as well as microtome methods. Consultations are free, so please feel free to contact us if you are unsure about the method for creating cross-sections. [Overview] ■ Observation of sensor component structure and sensor surface ■ Cross-section creation by mechanical polishing ■ SEM observation of the sensor chip surface layer *For more details, please download the PDF or feel free to contact us.

• Other analysis and evaluation services

Observation of the sensor chip surface, creating a cross-section through mechanical polishing in the mounted state, and conducting structural observation of the device!

We would like to introduce the "Tracking Camera Cross-Section Observation" through mechanical polishing. Regarding the structure of the tracking camera components, the lens can be confirmed when viewed from above, and while it cannot be clearly seen in the X-ray image, the lens is incorporated into the convex part. Additionally, the cross-sectional structure is the same as that of the RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is not necessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode. 【Features】 ■ The cross-sectional structure is a back-illuminated CMOS structure, similar to that of the RGB sensor. ■ There is no color filter layer since color information is not needed for the tracking camera. ■ A jagged uneven shape was observed on the surface of the photodiode. *For more details, please download the PDF or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

In public construction civil engineering sites, there are many instances where sheets are used as common temporary facilities, such as construction roads, access roads, heavy machinery work yards, material storage areas, and worker pathways. Traditionally, steel plates were common, but due to their weight, transportation and installation can be cumbersome. Hyper CLT sheets are civil engineering materials made from wooden CLT for civil engineering use. The 5×10 sheet weighs about 230 kg, and the 5×20 sheet weighs about 460 kg, making them lightweight and easy to transport, install, and remove, even with small machinery. They can be widely utilized for temporary roads, heavy machinery scaffolding, pathways within the site, and protection of material storage in public works. Since they are made of wood, they also contribute to environmental aspects such as reducing summer heat reflection, lowering noise, and fixing CO2. They can simultaneously address construction efficiency, safety measures, and environmental considerations, making them effective for innovative proposals in public works. Furthermore, they improve transportation efficiency and reduce labor in site operations as an alternative to steel plates. Hyper CLT sheets are registered technology with the Ministry of Land, Infrastructure, Transport and Tourism under NETIS "TH-250021-A." They are recommended for companies considering civil engineering, civil engineering use, and civil engineering CLT. Feel free to request materials or consult about implementation. They are temporary materials that also help improve site evaluations in public works. Please consider them.

We have released a new video on our company’s YouTube channel. The theme of this video is "The World of Amino Acid-Based Shampoos." Amino acid-based shampoos have become popular in recent years, but the lather, feel, and finish can vary greatly depending on the cleansing ingredients used. In this video, we clearly explain the changes in user experience based on the differences in cleansing ingredients by comparing two types of amino acid-based shampoos. We hope you can use this as a hint for developing original shampoos and differentiation.

New York and Tokyo, June 26, 2026 - (JCN Newswire) - This year's successful listing of PayPay Corporation (hereinafter "PayPay") on NASDAQ has provided a significant boost. The question now facing Japan's leading innovation companies is no longer "Is a U.S. listing feasible?" but rather "How can we attract global capital and build companies that align with global growth strategies?" The 2nd Japan Go IPO Summit will be held on September 16, 2026, at the Grand Hyatt Tokyo to address this question. This summit is hosted by MarcumAsia and organized by AUM Advisors. To register for this invitation-only event, please apply here: Japan GO IPO Summit Attendee Information https://events.marcumasia.com/view.php?id=32

Our company representative, Shibata, will be speaking as a lecturer at the "Mikata Project" AI Utilization Seminar for the automotive industry, hosted by the Chubu Bureau of Economy, Trade and Industry. ■ Title: AI Implementation Course Leading to Results - Learning Success Patterns and Practical Processes from Real Examples in Manufacturing Sites "We implemented AI, but it is not being used on-site and is left unattended" and "The implementation has become the goal without yielding results" - we have seen many such stumbling blocks in manufacturing sites. In the seminar, based on real examples, we will discuss common patterns for successful implementation that lead to results, pitfalls to avoid, and practical processes to ensure AI is continuously used. We will also propose specific measures for sites struggling with technology transfer and dependency on individuals. ■ Event Overview Date: July 3, 2026 (Friday) 13:30 - 16:00 Venue: TKP Meitetsu Nagoya Station Conference Center + Online Participation Fee: Free / Application Deadline: June 30 (Tuesday) Organizer: Chubu Bureau of Economy, Trade and Industry (Automotive Industry "Mikata Project") Co-presenter: Satoru Hayami, Waseda University For details and registration, please visit the official page of the Chubu Bureau of Economy, Trade and Industry. If you are struggling with AI implementation in manufacturing sites, please feel free to consult us, regardless of region or industry.

July 16 (Thursday) 10:00 AM - 6:00 PM Venue: Convex Okayama Small Exhibition Hall