12-inch wafer processing with ring attachment is possible! Surface modification, removal of inorganic/organic contamination! Ideal for evaluation and research before mass production! High speed, low cost.
★ 12-inch wafer processing with ring attachment is possible! ★ Surface modification, removal of inorganic/organic contamination! ★ Ideal for evaluation and research before mass production! ★ High speed, low cost ★ Various optional features ★ Compatible with 300mm wafers and rectangular substrates [Main Performance] - Achievable pressure: 6.0 Pa or lower (when gas ballast is closed) * Uses a dry pump with a maximum exhaust speed of 500 L/min - Leak rate: 1.07 Pa/min or lower * Build-up standard value: Converted to chamber volume as 0.1 Pa·L/sec - RF power control: 13.56 MHz / 100 to 1,000 W - Process gas flow control: Within ±10% of the set value - Etching performance Inorganic etching rate: Average of 20 nm/min or more ±20% Organic etching rate: Average of 500 nm/min or more ±20% Test chips placed at 5 points on a φ300 electrode * Placed at 4 points on the φ280 circumference and 1 point in the center * When using rectangular electrodes [optional], placed at 4 points on the corners of a 300 mm square and 1 point in the center Wide-range auto-tuning
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basic information
Device dimensions: 690 mm (W) x 580 mm (D) x 880 mm (H) Processing area: Φ 300 mm [standard] □ 350 mm [optional] Device weight: 350 kg excluding pump Power supply: Single-phase AC 200V 10 50/60Hz 3.0 kVA Air source: Between 0.4 MPa and 0.6 MPa Control panel: 4.3-inch TFT color LCD monitor, emergency stop, 1 USB port RF power supply: Maximum 1 kW: 13.56 MHz, application to the comprehensive communication bureau is required Gas source: Ar1 system standard: 0.1 to 0.15 MPa *O2 [additional option] Vacuum pump: Maximum exhaust speed: 500 L/min
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Applications/Examples of results
- Specific uses of plasma cleaner Improved mold adhesion (for IC protective film) Improved mold adhesion (for substrate resist) Increased wire bonding strength - Applicable substrates, including option selection 300mm wafer with frame 300mm wafer Lead frame Glass-epoxy substrate
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Company information
KNE Corporation develops, manufactures, and sells high-level automation equipment that automatically performs tasks impossible for human hands, rather than simply replacing "jobs done by people" with automation equipment. We provide equipment that realizes our customers' "wants" and solves their "problems," such as handling fine parts measuring 0.2mm x 0.1mm and applying electronic materials with high precision. Our field extends beyond the electronic component manufacturing sector to all areas of "monozukuri" (manufacturing), including machine parts and everything else.
