Greatly contributes to productivity and quality improvement! Introducing a case where multi-nozzles are coated with ToshiCal S coating!
At this semiconductor processing manufacturer, there was a problem with paste-like adhesive adhering to the side of the multi-nozzle pipe, causing variations in the application amount. They consulted with us and adopted "Toshical S TS-1310 (UNA310-X10)." After coating, it was found to be effective in preventing adhesion issues between the adhesive that overflowed during application and the side of the pipe, significantly contributing to improvements in productivity and quality. 【Overview】 ■ Customer: Semiconductor processing manufacturer ■ Target: Automatic adhesive application process ■ Implementation: Toshical S TS-1310 (formerly UNA310-X10) *For more details, please refer to the PDF document or feel free to contact us.
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basic information
[Reference] <Peeling force measurement data with vinyl acetate-based adhesive> ■ TOSHICAL S TS-1310: 0-50g ■ Teflon PTFE coating: 50-100g ■ Comparison example sus304 (untreated): 600-700g *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our company offers contract processing for surface functional modification of various substrates. Primarily, we create a dramatically non-adhesive surface by adding unevenness to surfaces that dislike adhesion, embedding special resin in the recesses while leaving it in an uneven shape. We provide non-adhesive coating "Toshical(R)S Coating Processing" and "Fine Blast Processing," which overcomes the weaknesses of sandblasting and shot blasting, allowing for uniform control of surface unevenness. Please feel free to contact us if you have any requests.
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