Mass production micro ball mounter compatible with up to 12-inch wafers.
This machine is a wafer ball mounter equipped with flux printing and ball mounting functions. With its unique non-contact ball mounting method, it can stably mount micro balls on the wafer without causing damage. It can also accommodate even smaller balls!!
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basic information
Main Features ■ Compatible with ball sizes from a minimum of φ50μm. ■ Stable ball mounting The unique non-contact ball mounting method allows for damage-free mounting of the balls. ■ Reduced material waste The automatic ball retrieval function minimizes surplus balls, effectively utilizing the materials introduced. ■ High-precision ball mounting High precision mounting is achieved through an automatic alignment mechanism using image recognition. ■ By connecting with the optional inspection and repair device (SBM381), it is possible to establish an automated production line.
Price range
Delivery Time
Applications/Examples of results
BGA/CSP with micro balls installed
Company information
Our company is headquartered in Kanazawa City, Ishikawa Prefecture, and has sales offices and factories both within and outside the prefecture. We focus on the bottling business, which involves filling beverages and other products, and we are expanding into various fields such as solid-liquid mixing and dispersion systems, laser processing machines (including fiber lasers and CO2 lasers), and semiconductor assembly equipment (such as taping machines, multifunctional test handlers, ball mount machines, and bonders). Please feel free to contact us if you have any inquiries.
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