11th Generation Intel Core equipped COM Express compact Type 6 (Rugged version): conga-TC570r
The 【conga-TC570r】 is a rugged version of the COM Express compact Type 6 module equipped with the 11th generation Intel Core (Tiger Lake UP3), with memory directly soldered to the board for vibration and shock resistance.
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basic information
Form Factor: COM Express compact Type 6 Processor: 11th Generation Intel Core (Tiger Lake) Memory: Up to 32 GB LPDDR4X 4266MT/s SDRAM soldered, dual channel IBECC Interfaces: 1x 2.5GbE TSN Ethernet via Intel i225 8 x PCI Express GEN 3.0 lanes PEG support x4 (PCIe Gen4) 4 x USB 3.1 Gen2, 8 x USB 2.0 2 x SATA III (6Gb/s), 2 x UART, 8 x GPIOs
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Applications/Examples of results
Railway vehicles, commercial vehicles, construction machinery, agricultural vehicles, autonomous robots, mobile applications, infrastructure protection (CIP: Critical Infrastructure Protection)
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Company information
Congatec is a manufacturer based in Germany that specializes in products for embedded computing, including standard form factor computer-on-modules such as COM Express, COM-HPC, and Qseven, SMARC according to SGET standards, as well as single-board computers (SBCs). In addition to manufacturing and selling board modules, they also offer services such as custom design and development, as well as product lifecycle management. Congatec's products, which are a trusted leading supplier in the embedded industry, are manufactured according to the latest quality standards and are designed to be robust and long-term supply capable. They are used in a wide range of applications across various fields, including industrial automation in harsh environments, medical imaging, transportation, telecommunications, testing and measurement, as well as smart factories, AI-based quality inspection, vision systems, collaborative robots, autonomous vehicles, and video security.