Supports wafers up to 150 or 200 mm! Etching angle and stage tilt/rotation mechanism.
The "scia Mill 150/200" is an ion beam milling device with a microwave ECR source (218mm diameter). The processes include ion beam etching/milling (IBE/IBM), reactive ion beam etching (RIBE), and chemical assist ion beam etching (CAIBE). Please feel free to consult us when needed. 【Features】 ■ Compatible with maximum 150 or 200mm wafer substrates ■ Microwave ECR source (218mm diameter) ■ RF type source (350mm diameter) ■ Etching angle and stage tilt/rotation mechanism *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Application】 ■ Etching of MRAM, GMT, TMR, etc. ■ Etching of MEMS (Au, Ru, Ta), etc. ■ Smoothing, reduction of micro-roughness *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company website features information on used equipment related to FPD and semiconductors. ● Main Business Activities Purchase of used semiconductor manufacturing equipment, refurbishment, sales, and setup operations Construction and consulting for semiconductor manufacturing lines Purchase of used FPD manufacturing equipment, refurbishment, sales, and setup operations Construction and consulting for FPD manufacturing lines Contract development, manufacturing, and sales of semiconductor manufacturing equipment and FPD manufacturing equipment Sales of various equipment parts Agency sales of overseas manufactured equipment