The ideal small sputtering device for research and prototyping: 'VS-R400G'
VS-R400G
Ideal for experiments, research, evaluation, and prototype production! Achieving high-speed, high-precision, low-damage vacuum deposition on flat substrates such as glass and metal!
The "VS-R400G" is a sputtering device that adopts a unique LIA (Low Inductance Antenna) plasma source, achieving ultra-fast and high-quality vacuum deposition. Thanks to the assist effect of the LIA method's inductively coupled plasma (LIA-ICP), it reduces damage without lowering the deposition speed, resulting in high-quality film formation. Additionally, it can also accommodate reactive sputtering by leveraging the characteristics of high-density plasma. 【Features】 ■ A sputtering device suitable for experiments, research, evaluation, and prototyping ■ Reduces damage without lowering deposition speed, achieving high-quality film formation ■ Capable of reactive sputtering by utilizing the characteristics of high-density plasma ■ Enables faster deposition speeds by incorporating a rotary cathode ■ Easy to expand into production machines *For more details, please refer to the related links or feel free to contact us.
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basic information
■Target substrates: Flat plates such as glass plates and metal plates 【Specifications (partial)】 - Target films: ITO, alumina, compounds, various metal films - Film formation methods: Deposition down, inline film formation *For more details, please refer to the related links or feel free to contact us.
Applications/Examples of results
【Applications】 ■Functional film ■Surface modification ■Surface treatment ■Modification ■Nitriding ■Oxidation ■Passivation *For more details, please refer to the related links or feel free to contact us.
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Model number | overview |
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VS-R400G | ・Target substrates: flat plates such as glass plates and metal plates |
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