3.5-inch application carrier board for COM-HPC Mini module: conga-HPC/3.5-Mini
The 【conga-HPC/3.5-Mini】 is a 3.5-inch application carrier board designed to implement and use the COM-HPC Mini module. It is an application-ready product that can be immediately integrated into industrial products, such as robust high-performance IIoT applications with space constraints, supporting an industrial temperature range of -40°C to +85°C. When used in combination with the aReady.COM version of the conga-aCOM/mRLP COM-HPC Mini module, the hypervisor and operating system are pre-installed. This solution is also ideal for system integrators, as it minimizes the complexity of integration below the application layer and the diverse IIoT functionalities of embedded and edge computing systems.
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basic information
Form Factor: 3.5" (146 x 102 mm) Internal I/O M.2 Key M 2242/3042/2260/2280 (PCIe x4) M.2 Key B 2242/3042 (USB2, PCIe x2, SIM) M.2 Key E 2230 (USB2, 2x PCIe) USB2, SATA III, Audio, 2x UART CAN, GP SPI, eSPI, 12x GPIO, Feature header SMB, 2x I2C, 4pin Fan, SPI boot flash, RTC CMOS battery holder ATX power connector 4-pin External I/O 2x 2.5GbE RJ45 2x Dual USB 3.2 Type A USB Type C DP++ Audio Jack 4-pin
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Applications/Examples of results
Robust high-performance IIoT applications with space constraints.
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Company information
Congatec is a manufacturer based in Germany that specializes in products for embedded computing, including standard form factor computer-on-modules such as COM Express, COM-HPC, and Qseven, SMARC according to SGET standards, as well as single-board computers (SBCs). In addition to manufacturing and selling board modules, they also offer services such as custom design and development, as well as product lifecycle management. Congatec's products, which are a trusted leading supplier in the embedded industry, are manufactured according to the latest quality standards and are designed to be robust and long-term supply capable. They are used in a wide range of applications across various fields, including industrial automation in harsh environments, medical imaging, transportation, telecommunications, testing and measurement, as well as smart factories, AI-based quality inspection, vision systems, collaborative robots, autonomous vehicles, and video security.