No more revolution! No need for washing; particles are removed with just air blowing.
<Compatible with Class 100! Can be used for cleaning semiconductors> This air nozzle, utilizing a patented unique technology, has an air ejection power that is on a completely different level compared to conventional air nozzles. It removes particles adhered to semiconductors through powerful air blowing. (Compatible with Class 100) In other words, the cleaning process that used to involve three steps: "1. Water washing ⇒ 2. Water draining ⇒ 3. Drying" has been completely transformed. It can now be completed in one step using only "air blowing" without any water. This significantly shortens the process. ■ Benefit 1: Increased productivity and production volume The entire sequence of water washing, water draining, and drying is replaced by cleaning with only air blowing. This means that water washing, water draining, and drying are no longer necessary, leading to a remarkable improvement in productivity and production volume. ■ Benefit 2: Improved operational efficiency and cost reduction As mentioned above, the elimination of the entire sequence allows for significant cost cuts on personnel, various equipment, and the running costs and electricity expenses associated with those equipment. ■ Benefit 3: Improved yield With cleaning power that cannot be compared to other air nozzles, it contributes to improved yield. This helps enhance production efficiency.
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basic information
■Feature 1: Rotational Waves Generating Unmatched Power It is generally believed that strong winds can remove dust, but even with static electricity measures using an ionizer, attached dust will not be blown away. This is because dust removal capability ultimately depends on the nozzle's performance. The key is not strength, but "quality." Our air nozzle processes air with rotational waves to generate cut air. This cut air produces destructive power many times greater than that of a conventional air nozzle, thoroughly blowing away even fine particles. ■Feature 2: Thorough Cleaning with Air Blow for Any Shape Our air nozzle demonstrates significant effectiveness on objects with protrusions, grooves, depressions, and uneven surfaces. The cut air generated by rotational waves excels at scraping out debris from within grooves and depressions, reaching deep into them and removing contaminants solely with air blow. ■Feature 3: Applicable Across Various Industries Our air nozzle is compatible with Class 100 standards. It can be used not only in clean rooms for semiconductors but also in a wide range of industries that require cleaning processes. We have a proven track record of supplying many companies and factories, including major industry leaders.
Price information
We will provide a quote individually. Please contact us first. <By utilizing subsidies, it is possible to implement at up to half the cost.> Our company also offers support and assistance for utilizing various subsidies. Please feel free to consult with us. *The amount and rate of subsidies vary depending on the type of subsidy used and the size of the company. We will propose the most suitable option for your company, so please consult with us.
Delivery Time
※We also accept orders for cleaning and drying machines, not just for air nozzles alone. Since we customize them individually, the delivery time will vary accordingly. Please contact us first.
Applications/Examples of results
【Application】 - Removal of particles adhered to semiconductors (Class 100 compatible) - Dust and chips are also removed with high cleanliness (clean room compatible) - Dirt and dust stuck to the workpiece can be cleaned using only air blow without water. With the air blow from this air nozzle, even stubborn dirt and adhered dust gradually come off using only air blow without water. 【Test Results from Demo Unit】 Conclusion: All debris larger than 500μm (0.5mm) was removed by air blow. The dust removal test using air blow was conducted as follows: 1. Place debris in any location on the tray. - Size of debris: below 20μm, 20-40μm, 40-100μm, 500μm (0.5mm) - Types of debris: airborne particles excluding adhesive types, fibers, resins, etc. 2. Check the number and location of debris under a microscope. 3. Perform air blow cleaning with the demo unit. 4. Check the debris under a microscope to confirm the cleaning effectiveness. 5. Confirmed that all debris larger than 500μm (0.5mm) was removed.
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Company information
■■■ 100% Water Removal and Complete Drying, the Only Air Nozzle ■■■ "Air Screw Nozzle" (Patent Obtained: Patent No. 6749741) An essential cleaning process in product manufacturing. Until now, there has been no air nozzle capable of completely blowing away water droplets that adhere to the workpiece after cleaning. In fact, the industry has come to accept the notion that "complete water removal with an air nozzle is impossible." However, our "Air Screw Nozzle" overturns that common belief. With our uniquely developed cutting air using rotational waves, it achieves 100% water removal from the workpiece after cleaning. This realizes "complete drying" and eliminates the need for drying processes using warm air or warm rooms after cleaning. Moreover, its power extends beyond just water removal. Stubborn dirt that has adhered, dust, and grime that has settled into scratches can gradually be removed with air blowing alone, without the need for water. (In some cases, degreasing or chemical cleaning may be necessary.) Additionally, it stands out from other nozzles in its ability to remove dust and chips. (Compatible with clean rooms) ★ You can watch a video of the actual water removal and air blowing process. Download the catalog now and see for yourself.
![[Semiconductor/Class 100 Compatible] 100% Water-Free Air Nozzle](https://image.mono.ipros.com/public/product/image/2116982/IPROS15202438644694791694.png?w=280&h=280)