Ion Assist Sputtering Deposition Equipment

For engineers in the wear-resistant coating industry! Precise control of film stress.

We offer an "Ion Assist Sputtering Deposition System (PVD)" that can handle everything from research and development to small-scale production. This system can be applied to a wide range of fields, including semiconductor devices, nanotechnology, ferroelectric and ferromagnetic thin films, and superconducting thin films. In particular, as an alternative technology to bias sputtering, it achieves dense and highly adherent thin film deposition, making it easy to control film stress. Furthermore, it supports high-temperature deposition up to a maximum substrate temperature of 800°C, and deposition on insulating substrates is also possible. 【Features】 - Provides dense and highly adherent thin films due to the high-temperature substrate heating mechanism and ion assist effect. - Wafer carrier with excellent thermal conductivity. - Supports alloy deposition and deposition of oxides and nitrides via reactive sputtering. - Uses an end-hole type (Kaufman type) ion source with strong directionality and concentrated ion energy bandwidth. - Accommodates lab-scale to small-scale production, delivering thin films with excellent density and adhesion. *For more details, please feel free to contact us.

Sputtering Equipment