For engineers in the wear-resistant coating industry! Precise control of film stress.
We offer an "Ion Assist Sputtering Deposition System (PVD)" that can handle everything from research and development to small-scale production. This system can be applied to a wide range of fields, including semiconductor devices, nanotechnology, ferroelectric and ferromagnetic thin films, and superconducting thin films. In particular, as an alternative technology to bias sputtering, it achieves dense and highly adherent thin film deposition, making it easy to control film stress. Furthermore, it supports high-temperature deposition up to a maximum substrate temperature of 800°C, and deposition on insulating substrates is also possible. 【Features】 - Provides dense and highly adherent thin films due to the high-temperature substrate heating mechanism and ion assist effect. - Wafer carrier with excellent thermal conductivity. - Supports alloy deposition and deposition of oxides and nitrides via reactive sputtering. - Uses an end-hole type (Kaufman type) ion source with strong directionality and concentrated ion energy bandwidth. - Accommodates lab-scale to small-scale production, delivering thin films with excellent density and adhesion. *For more details, please feel free to contact us.
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basic information
【Specifications (Partial)】 ■Substrate size: From 2 inches Φ to 6 inches Φ, thickness < 1mm ■Substrate temperature: 800℃ (Max) ■Horizontal type - Deposition down ■Cathode: 3 cathodes, compatible with RF and DC sputtering ■Target size: 4 inches *For more details, please feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Supports all metals such as Al, Cu, Au, Ag, Ti, W, Cr, etc., and alloy film deposition using a cost-effective sputtering method with up to 3 targets. ■ Capable of high-density film deposition of wear-resistant nitrides like BN, V2O5 (mott transition materials), and ferroelectric ternary oxides. ■ A new high-density thin film deposition method with ion assist effects that can replace DC and RF bias sputtering. *For more details, please feel free to contact us.
Company information
Our company offers etching, film deposition, and cutting equipment utilizing plasma technology, as well as the sale of ICP, RIE, DSE, IBE, IBD, PECVD, HDPCVD, and HDRF F.A.S.T.-ALD equipment, along with customer service related to these devices. Plasma-Therm LLC, headquartered in Florida, USA, was established in 1974. Since its founding, it has been manufacturing and selling semiconductor manufacturing equipment utilizing plasma technology for 48 years. Please feel free to contact us for inquiries. ▼ Group company Corial official website https://corial.plasmatherm.com/en
