Supports from half an inch to 12 inches! A MEMS prototyping partner that solves challenges in the semiconductor field with advantageous taper angle control for plug embedding.
M.T.C Corporation is a research and development-oriented contract processing company with the corporate philosophy of "bridging the seeds and needs of MEMS technology." We aim to contribute to society through "environmentally friendly technology" such as miniaturization and integration. Are you facing issues such as void formation during Cu plating embedding, contact failures due to bottom breakage or residues, and the absence of seed sputter film on the via bottom side in the TSV (Through-Silicon Via) formation process? Our company provides a solution that fundamentally addresses these challenges by intentionally establishing a taper angle during the deep etching stage. Furthermore, we strongly support not only processing but also the advanced development of MEMS devices, such as vibration energy harvesting elements for next-generation IoT devices.
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[Recommended for developers facing these challenges] Void and contact defects occur in Cu plating during the TSV process, and yield rates are not improving. I want to prototype via holes with special tapered shapes, but I can't find a processing company that can accommodate this. I would like to request prototype processing of special sizes, from 12-inch large diameter wafers to half-inch small diameter ones. I am looking for a collaborative development and prototyping partner for self-powered devices (environmental energy generation elements) and high-sensitivity sensors for IoT devices.
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Our company offers MEMS processing outsourcing, MEMS device development, and MEMS consulting services. Through MEMS technology, we create a prosperous future for people. Please feel free to contact us if you have any inquiries.


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