Electrical testing for semiconductor package substrates - full panel size inspection available.
Full panel size support! A high-capacity, high-speed, and high-precision inspection solution compatible with a maximum point count of 24Kch.
We would like to introduce our high-speed and high-precision inspection equipment for semiconductor packages, the 'GATS-7885'. This electrical inspection system achieves high-speed and high-precision probing for electrical testing of FOPLP/RDL using glass carriers. 【Features】 ■ Capable of inspecting full panel size (510×515 mm) ■ Supports up to 24K channels on the upper side ■ Overall alignment accuracy of ±3.5 μm ■ Capable of two types of RSD inspections ■ Compliant with SEMI standards *For more details, please download the PDF or feel free to contact us.
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Our inspection target areas include printed circuit boards, semiconductor packages, and display panels. These are core components of information and communication devices that are growing increasingly due to advancements in IT, as well as widely adopted digital home appliances. Printed circuit boards, semiconductor packages, and display panels are evolving at an astonishing speed, and higher precision technologies are required in inspections. Our company holds a significant share in these inspection fields that demand cutting-edge technology, and we have delivered numerous products recognized as "de facto standards" in the industry worldwide.
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