Semiconductor package multi-surface full panel substrate inspection device
Support for a total of 48K points in both vertical and horizontal directions! A high-speed inspection solution for multi-panel arrangements of large full-panel PCBs (500×620mm).
We would like to introduce our semiconductor package multi-site full panel substrate inspection equipment, the 'GATS-8370'. It is optimal for next-generation semiconductor packages with larger unit sizes and more pins. This high-precision electrical inspection device supports bulk and high-speed inspection of full panel substrates. It achieves efficient step-and-repeat inspection with a single shuttle, balancing quality improvement and reduced takt time. 【Features】 ■ Comprehensive inspection with a large capacity of 48K points (49,152p) ■ Bulk inspection of large unit products (up to 300mm) ■ Compatible with large full panel sizes (500mm × 620mm) *For more details, please download the PDF or feel free to contact us.
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Our inspection target areas include printed circuit boards, semiconductor packages, and display panels. These are core components of information and communication devices that are growing increasingly due to advancements in IT, as well as widely adopted digital home appliances. Printed circuit boards, semiconductor packages, and display panels are evolving at an astonishing speed, and higher precision technologies are required in inspections. Our company holds a significant share in these inspection fields that demand cutting-edge technology, and we have delivered numerous products recognized as "de facto standards" in the industry worldwide.




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