Water jet cutting process for internal verification of semiconductor packages.

With our extensive experience and track record in water jet cutting, we accept requests for prototyping and verification cutting of difficult-to-process materials such as metals, resins, and composites.

We conducted precision cutting to verify the internal structure of containers and structures that protect silicon chips (IC chips) with finely etched circuits and connect them electrically to external substrates. Processing Know-How (Setting): By deeply understanding the characteristics of the delicate multilayer structure's stacking pitch and materials, we established optimal settings to minimize tiny vibrations and delamination during cutting. This allows for accurate exposure of the internal bonding conditions as they are. High-Pressure Water Jet (Hardware): Through non-thermal cutting that exerts no thermal influence, we thoroughly eliminate the melting of resin, the generation of internal stress, and interlayer delamination. Without concerns about thermal deformation or structural changes, it is possible to accurately verify the fine structures and joints of the package. As seen in the semiconductor package verification cutting images, even in complex package structures with a mix of materials of varying hardness, such as metal layers, resin layers, and silicon, we expose extremely clean and sharp cross-sections without causing interlayer delamination or deformation. Since we can verify the internal conditions clearly and without distortion, we strongly support the acquisition of reliable data for quality evaluation and analysis.

Composite MaterialsSemiconductors and ICs