For correcting and fixing the warping of films, wafers, and thin plates. Choose from 3 methods × 60 standard types.
Vacuum suction stages and suction plates that can be selected from three methods: through-hole, V-groove, and porous ceramic, with 60 standard types available. Designed for correcting warpage and securing thin plates such as films, wafers, and glass substrates, as well as for fixing workpieces during inspection and assembly. Heat resistance is standard at 200°C and can be customized up to 500°C, suitable for wafer chucks, film chucks, and equipment integration. Custom manufacturing of sizes and shapes is available from one unit.
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basic information
Through holes, V grooves, porous adsorption - three types of adsorption methods + a variety of sizes to choose from.
Price range
Delivery Time
Applications/Examples of results
Film, thin material, wafer, glass material
Company information
We invite production engineers and manufacturing staff to visit the MSA Factory website, which provides strong support!
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