X-ray CT Observation Service | JTL
Observation Analysis > Observation Service > Non-destructive Internal Structure Observation > X-ray CT Observation Service
We use X-ray CT to non-destructively observe and inspect the internal structure of products in three dimensions.
The X-ray CT observation service allows for the non-destructive three-dimensional (stereoscopic) observation, inspection, and measurement of the internal structural condition of test specimens. Various evaluations can be performed from the X-ray CT images constructed as 3D data, including confirmation of the positional relationships of voids, verification of the fit of mating parts, and failure analysis.
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basic information
【Observation of Large Products with High-Power X-Ray Tubes】 Samples up to φ260×H300mm can be observed, allowing for the internal structure of large samples to be confirmed without destruction. Thanks to micron-order focal dimensions, clear and high-resolution images can be obtained. 【Diverse Image Processing】 - Cross-sectional observation at any position is possible. - Slice images with a minimum thickness of 5μm (10μm for Dage products) can be created. - Continuous slice images can be constructed as videos. - By displaying the base material as a skeleton, specific areas or marked sections can be highlighted. - 3D color image display and pseudo-color display allow for observations tailored to evaluation purposes by adding color to the images. 【Various Measurement Functions】 Simple dimensional measurements and area measurements (using dedicated software winroof) can be performed. 【Support for Output to STL Data】 Data scanned with CT can be output to STL format. This can be used for evaluations at the observation level (such as simple dimensional measurements).
Price information
The price varies depending on the details of the observation, so please feel free to contact us.
Delivery Time
※The delivery date may vary depending on the observation details, so please feel free to contact us.
Applications/Examples of results
- Confirmation of bonding conditions for various electronic devices such as chip components, BGA, and wire bonding (disconnection, voids, contact) - Observation of voids in aluminum castings - Confirmation of the fitting condition of components (crimping condition) - Observation of the orientation of filler within grease (partially possible) - Confirmation of wire disconnection inside the product - Confirmation of the winding condition of coils - Internal void inspection of resin molded products - Internal foreign matter inspection of resin and ceramics
Company information
Our main business is providing technical services to evaluate the reliability of developed products. We not only provide evaluation data in accordance with standards and regulations, but also propose optimal methods, conditions, and equipment for evaluation purposes, as well as design and manufacture original equipment and jigs for non-standard evaluations. Additionally, we handle three evaluation techniques—measurement, testing, and analysis—comprehensively, allowing us to offer complex services that span diverse equipment and suggest more multifaceted evaluation methods.
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