Non-contact suspension transport of workpieces using air jets! Bernoulli chuck.
The new mechanism adopts the "vertical gas jet method." This method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing friction losses of the gas flow within the chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capacity compared to conventional types. This results in improved stability of the holding mechanism, increased resistance to shocks, and nearly halving the gas consumption. The "float chuck" generates negative pressure through the ejector effect and Bernoulli effect by ejecting gas, as well as positive pressure through the pressure-type air cushion effect, allowing the workpiece to be suspended in a non-contact state while floating in the air, enabling transportation, inversion, and tilting.
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basic information
The new mechanism adopts the "vertical gas jet method." This method allows the gas flow ejected from the nozzle to create a vertical gas jet in the cushion chamber, reducing friction loss of the gas flow within the chamber, enhancing the effect of negative pressure generation, and significantly increasing the suspension capability compared to conventional types. This results in improved stability of the holding mechanism, greater resistance to impact, and nearly halving the gas consumption. It enables non-contact suspension transport of semiconductor wafers, LCD/PDP glass substrates, discs, printed ceramic substrates, through-hole substrates, films, paper, non-woven fabrics, ultra-thin workpieces, and breathable workpieces using air jets.
Price information
90,000 to 190,000 yen
Delivery Time
※-
Applications/Examples of results
By ejecting gas, it generates negative pressure through the ejector effect and Bernoulli effect, and positive pressure through the pressure-type air cushion effect, allowing the workpiece to be suspended in mid-air in a non-contact state for transport, inversion, and tilting. Also known as a Bernoulli chuck. It can be used in ultra-clean rooms due to the exhaust recovery mechanism. There is no contamination, damage, or pad marks. It is compatible with semiconductor wafers, LCD/PDP glass substrates, disks, printed ceramic substrates, through-hole substrates, films, paper, non-woven fabrics, ultra-thin workpieces, breathable workpieces, and more. A device for transporting wafers and LCD/PDP glass substrates in a non-contact manner.
Company information
Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.
![[Analysis Case] Evaluation of Metal Impurities in the Metal Film and Interface of the Device](https://image.mono.ipros.com/public/product/image/19d/2001538620/IPROS12249256516974712398.jpg?w=280&h=280)
