Book 【WS242】 "Lead-Free" Compatibility - Accelerated Testing and Reliability Evaluation Methods for BGA, CSP, and Flip Chip Solder Joints 【Non-Company Designated Product】
【WS242】
Book 【WS242】 "Lead-Free" Compatibility - Accelerated Testing and Reliability Evaluation Methods for BGA, CSP, and Flip Chip Solder Joints 【Non-Company Designated Product】
Book [WS242] "Lead-Free" Compliance Accelerated Testing and Reliability Evaluation Methods for BGA, CSP, and Flip Chip Solder Joints [Non-Company Designated Product] ■□■ Book Content ■□■ This book explains the "Lead-Free" compliance and the accelerated testing and reliability evaluation methods for BGA, CSP, and flip chip solder joints. We hope you will acquire these techniques and foster a mindset for improvement in the field. ■□■ Authors ■□■ ■ Ikuo Soji, Associate Professor, Department of Mechanical Systems Engineering, Gunma University ■ Yasumitsu Orii, Department Manager, High-Density Packaging Solutions Development, IBM Japan, Ltd. ■ For more details, please contact us.
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Book [WS242] "Lead-Free" Compliance Accelerated Testing and Reliability Evaluation Methods for BGA, CSP, and Flip Chip Solder Joints [Non-Company Designated Product] ■□■ Book Content ■□■ This book explains the "Lead-Free" compliance and the accelerated testing and reliability evaluation methods for BGA, CSP, and flip chip solder joints. We hope you acquire these techniques and foster a mindset for improvement in the field. ■□■ Authors ■□■ ■ Ikuo Soji, Associate Professor, Department of Mechanical Systems Engineering, Gunma University ■ Yasumitsu Orii, Department Manager, High-Density Packaging Solutions Development, IBM Japan, Ltd. ■ For more details, please contact us.
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■□■Application■□■ Person in charge of reliability and quality evaluation of flip chip solder joints.
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