List of Electronic Components and Modules products
- classification:Electronic Components and Modules
6571~6585 item / All 61221 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Support from product planning to filling, processing, and shipping for additives, cleaning agents, chemicals, deodorizing and disinfecting agents, etc.! For those who have raw materials but no place t...
- Other consumables
- Processing Contract
We provide consistent support from sample disassembly to measurement.
- Contract Analysis
- lens
The diffusion layer structure of SiC devices can be visualized (high-sensitivity evaluation of the diffusion layer structure).
- Contract Analysis
- Transistor
The evaluation of the crystal structure can be performed based on the STEM images and the results of atomic composition measurements.
- Contract Analysis
- magnet
- Memory
Microscopic structural analysis of amorphous films is possible through simulation.
- Contract Analysis
- Memory
Evaluation of particle size and crystal orientation of living materials, atomic-level observation is possible.
- Charger
- Contract measurement
This is a method for conducting elemental analysis and compositional analysis by detecting fluorescent X-rays generated by irradiating with X-rays and spectrally analyzing them using energy or a spect...
- Contract Analysis
- Other contract services
- Circuit board design and manufacturing
It is a method for measuring the energy and intensity of ions scattered backward by Rutherford scattering after irradiating a solid sample with an ion beam.
- Contract Analysis
- Other contract services
- Circuit board design and manufacturing
It is possible to confirm the stress distribution in the sample cross-section.
- Contract Analysis
- Wafer
It is possible to evaluate trace metals in ppm orders.
- Contract Analysis
- Ceramics
- Wafer
Evaluation of functional groups in graphene is possible using thermal decomposition GC/MS method.
- Contract Analysis
- Transistor
- Power storage device
Reverse engineering of smartphone components
- Contract Analysis
- lens
Quantitative evaluation of the quality of sensory products is possible.
- Contract Analysis
- LCD display
Non-destructive three-dimensional observation of the internal structure of a discrete package.
- Contract Analysis
- Other semiconductors
Quantitative evaluation of the roughness of trench sidewalls related to device characteristics.
- Contract Analysis
- Other semiconductors
Evaluation of microscopic atomic structures is possible through computational simulation.
- Contract Analysis
- Other semiconductors