List of Electronic Components and Modules products

  • classification:Electronic Components and Modules

6571~6585 item / All 61221 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Support from product planning to filling, processing, and shipping for additives, cleaning agents, chemicals, deodorizing and disinfecting agents, etc.! For those who have raw materials but no place t...

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  • Other consumables
  • Processing Contract

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We provide consistent support from sample disassembly to measurement.

  • Contract Analysis
  • lens

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The diffusion layer structure of SiC devices can be visualized (high-sensitivity evaluation of the diffusion layer structure).

  • Contract Analysis
  • Transistor

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The evaluation of the crystal structure can be performed based on the STEM images and the results of atomic composition measurements.

  • Contract Analysis
  • magnet
  • Memory

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Microscopic structural analysis of amorphous films is possible through simulation.

  • Contract Analysis
  • Memory

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Evaluation of particle size and crystal orientation of living materials, atomic-level observation is possible.

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  • 二次粒子の断面SEM像(拡大).png
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  • 結晶構造モデル.png
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  • Charger
  • Contract measurement

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This is a method for conducting elemental analysis and compositional analysis by detecting fluorescent X-rays generated by irradiating with X-rays and spectrally analyzing them using energy or a spect...

  • 打ち合わせ.jpg
  • セミナー.jpg
  • Contract Analysis
  • Other contract services
  • Circuit board design and manufacturing

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It is a method for measuring the energy and intensity of ions scattered backward by Rutherford scattering after irradiating a solid sample with an ion beam.

  • 打ち合わせ.jpg
  • セミナー.jpg
  • Contract Analysis
  • Other contract services
  • Circuit board design and manufacturing

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It is possible to confirm the stress distribution in the sample cross-section.

  • Contract Analysis
  • Wafer

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It is possible to evaluate trace metals in ppm orders.

  • Contract Analysis
  • Ceramics
  • Wafer

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Evaluation of functional groups in graphene is possible using thermal decomposition GC/MS method.

  • Contract Analysis
  • Transistor
  • Power storage device

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Quantitative evaluation of the quality of sensory products is possible.

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  • Contract Analysis
  • LCD display

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Non-destructive three-dimensional observation of the internal structure of a discrete package.

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  • サンプル全景.png
  • サンプル外観.png
  • X線透過像.png
  • 開封後のサンプル内部構造.png
  • Contract Analysis
  • Other semiconductors

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Quantitative evaluation of the roughness of trench sidewalls related to device characteristics.

  • Contract Analysis
  • Other semiconductors

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Evaluation of microscopic atomic structures is possible through computational simulation.

  • Contract Analysis
  • Other semiconductors

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