List of Manufacturing and processing machinery products

Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

• Other conveying machines

Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!

• Other machine tools

Non-contact lead-free soldering laser unit compatible with fine thermal control resin bonding.

• Soldering Equipment

High-speed Die Bonder compatible with micro and thin chips!

• Printed Circuit Board
• Substrate transport device (loader/unloader)

A new microball system that meets individual piece needs! Reduces ball consumption.

• Circuit board processing machine

The versatile bond tester DAGE4000 has been completely redesigned, becoming more multifunctional and achieving higher precision, thus being reborn!

• Tester

It can handle various bonding strength tests in the assembly process of various semiconductor components and electronic parts, as well as in the mounting process on substrates, all with one machine!

• Tester

Achieves high-speed and stable solder ball mounting with a unique solder ball mounting method!

• Mounter

Features stable solder ball mounting and improves productivity through an inline system.

• Other semiconductor manufacturing equipment

Reliable solder ball repair is performed using high-speed image processing and a uniquely developed repair unit.

• Semiconductor inspection/test equipment

Freeze-drying of fine particles is possible! Testing available for cosmetics, microorganisms, regenerative medicine, and more.

• Other machine tools

We are currently conducting test drying for customers considering the introduction of freeze-drying equipment!

• Other food machinery

A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].

• High pressure cleaner
• Other semiconductor manufacturing equipment
• Resist Device

Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).

• Other semiconductor manufacturing equipment

We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.

• Wafer processing/polishing equipment

It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.

• Bonding Equipment

Both upper and lower surfaces can be UV irradiated. Even with an affordable version that is easy to use, we thoroughly pursue cost-effectiveness (effectiveness) in curing.

• Other semiconductor manufacturing equipment