List of Manufacturing and processing machinery products
- classification：Manufacturing and processing machinery
4141～4185 item / All 102855 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
By combining parts, it is possible to produce large pallets of 2m x 4m size. Even if damaged, partial replacement is possible, making it economical. *Available from a single piece.
- palette
Are you struggling with air pressure leaks and gas defects from the thick meat section? We can prevent shrinkage cavities in advance through casting simulation and ensure the airtightness of your prod...
- Contract manufacturing
- Processing Contract
Isn't it ambiguous whose responsibility it is, the casting accuracy or the machining accuracy? We provide consistent support from pattern design to machining, ensuring the accuracy of the AC4B-F casin...
- Contract manufacturing
- Processing Contract
I want to replicate a part that only has the physical object and no drawings. I will measure the shape with the latest 3D scanner and replicate it consistently through casting and machining.
- Contract manufacturing
- Processing Contract
We cannot find a prototype processing partner for other companies' cast products. We will accept machining only with the know-how of an aluminum casting manufacturer and will produce prototypes in the...
- Processing Contract
- Contract manufacturing
We cannot find a processing destination for components for semiconductor devices. We accept machining only with the know-how of an aluminum casting manufacturer and will prototype in the shortest time...
- Processing Contract
- Contract manufacturing
Over 20,000 units shipped with a track record! Reliability made in Japan and comprehensive after-sales service.
- Other machine tools
- Other processing machines
- Contract manufacturing
Customization capabilities to meet user requests.
- Other machine tools
- Other processing machines
- Contract manufacturing
Achieving quality control and defect prevention through computer control.
- Assembly Machine
- Casting Machine
Odor-Lock MASK: odor (smell) + lock (to seal)
- Deodorant
- Other factory parts
- Food environmental hygiene/contamination prevention equipment
Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.
- Heating device
- Electric furnace
- Annealing furnace
VOXIA compact X-ray CT imaging device
Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. * X-ray tube voltage: 20-90kV, or 40-maximum 130kV * Focus diameter: 7μm (5μm@4W) * Detector pixel: 89μm, approximately 3.2 million pixels! * Sample size: Φ120mm ◉ Vcap (Control Software): A custom-made imaging stage tailored to the subject and purpose. A series of tasks from shooting to image output can be performed with just a click. High-speed continuous shooting in as fast as 20 seconds, with processing from shooting start to image reconstruction taking about 30 seconds. ◉ VCT (Reconstruction Software): Customizable automatic measurement and analysis software specialized for the specified subject. High-speed reconstruction of shooting data with 992 x 992 pixel images and 600 projections in just 3.8 seconds! ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were difficult with conventional software. Software for displaying, processing, and measuring the imaged object. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.
Plasma CVD equipment compatible with wafer sizes of Φ3 inch and Φ4 inch. Rapid synthesis of clean, high-quality graphene while suppressing impurities.
- CVD Equipment
■□【PyroMini USB】 USB-connected compact infrared temperature sensor □■
USB-connected compact infrared temperature sensor, no power supply needed, powered via USB bus from PC, parameter settings and data management with included dedicated software. 【Overview】 Simply install the standard included "CalexConfig" and connect to a Windows PC using a USB cable. You can easily set measurement parameters, conduct measurements, and analyze results with CSV output on your PC in a plug-and-play manner. 【Features】 ◎ USB data logging ◎ Excellent basic performance: accuracy ±1%, reproducibility ±0.5%, 240 msec fast response ◎ Covers measurement wavelength range of 8 to 14 μm ◎ Compact size Φ18mm x 45mm 【Other Specifications】 ◉ Field of view: ・PMU21: 2:1 ・PMU201: 20:1 ◉ Temperature range: -20℃ to 1000℃ ◉ Measurement wavelength range: 8-14 μm ◉ Emissivity: 0.2 to 1.0 ◉ Power supply: not required ◉ Body dimensions: Φ18mm (diameter) x 45mm (length) ◉ Weight: approximately 85g ◉ USB cable length: 1.5m
Two thin-film experimental devices are connected with a load-lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load-lock.
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
[SH Vacuum Substrate Additional High-Temperature Plate Heater_Max 1100℃] For CVD and PVD Vacuum Thin Films
ThermoCera Japan has updated the latest catalog for its ultra-high temperature substrate heating heaters, suitable for thin film experiments such as CVD and PVD, ranging from 1 inch to 4 inches. ◉ Maximum operating temperature: 850°C (SH-IN), 1100°C (SH-BN) We also accommodate requests for customized products such as substrate holders, vertical lift mechanisms, substrate rotation mechanisms, and RF bias. Additionally, we offer heater controllers in both traditional standalone models and 19-inch rack mount options.
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
We have incorporated all the latest vacuum deposition technology into a compact benchtop-sized device that can effectively utilize limited lab space.
- Evaporation Equipment
■□【PyroMini】□■ Compact High-Performance Infrared Temperature Sensor
High-performance touch panel converter for easy setup, data logging, and data storage on microSD card. The PM2.2 model can also measure glossy metal surfaces. 【Overview】 With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*An option for a converter without a display is also available.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurement in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving equipment such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting high temperatures (Max 2000℃) and measurements of glossy metal material surfaces. 【Features】 ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, reproducibility ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm
Probe card maintenance sheet that can be used 5 to 10 times in the same area, reducing replacement frequency with a self-repairing coating.
- Tester
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
- Heating device
- Annealing furnace
- Electric furnace
VOXIA compact X-ray CT imaging device
Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. * X-ray tube voltage: 20-90kV, or 40-maximum 130kV * Focus diameter: 7μm (5μm@4W) * Detector pixel: 89μm, approximately 3.2 million pixels! * Sample size: Φ120mm ◉ Vcap (Control Software): A custom-made imaging stage tailored to the subject and purpose. A series of tasks from shooting to image output can be performed with just a click. High-speed continuous shooting in as fast as 20 seconds, with processing from shooting start to image reconstruction taking about 30 seconds. ◉ VCT (Reconstruction Software): Customizable automatic measurement and analysis software specialized for the specified subject. High-speed reconstruction of shooting data with 992 x 992 pixel images and 600 projections in just 3.8 seconds! ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were difficult with conventional software. Software for displaying, processing, and measuring the imaged object. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
- Heating device
- Annealing furnace
- Electric furnace
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely accommodates various purposes from research and development to small-scale production.
- Annealing furnace
VOXIA compact X-ray CT imaging device
Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. * X-ray tube voltage: 20-90kV, or 40-maximum 130kV * Focus diameter: 7μm (5μm@4W) * Detector pixel: 89μm, approximately 3.2 million pixels! * Sample size: Φ120mm ◉ Vcap (Control Software): A custom-made imaging stage tailored to the subject and purpose. A series of tasks from shooting to image output can be performed with just a click. High-speed continuous shooting in as fast as 20 seconds, with processing from shooting start to image reconstruction taking about 30 seconds. ◉ VCT (Reconstruction Software): Customizable automatic measurement and analysis software specialized for the specified subject. High-speed reconstruction of shooting data with 992 x 992 pixel images and 600 projections in just 3.8 seconds! ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were difficult with conventional software. Software for displaying, processing, and measuring the imaged object. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.
6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely supports various purposes from research and development to small-scale production.
- Annealing furnace
- Heating device
- Electric furnace
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
Heat recovery type hot air drying furnace that achieves improved coating quality, energy savings, and safety.
- Other painting machines
- Drying Equipment
For transporting heavy items such as lathes and grinding machines. No towing device is required, allowing for space-saving and safe installation and movement even in narrow factory environments.
- Other conveying machines
Intelligent real-time decision-making with minimal resources.
- Software (middle, driver, security, etc.)
- Other information systems
- Other industrial robots
Invitation to Exhibit at EdgeTech+ 2026
We are pleased to announce that we will be exhibiting at "EdgeTech+ 2026," which will be held from November 18 (Wednesday) to November 20 (Friday), 2026, at Pacifico Yokohama. We cordially invite you to visit us during this opportunity. <Exhibition Overview> Name: EdgeTech+ 2026 Dates: November 18 (Wednesday) to November 20 (Friday), 2026, 10:00 AM - 5:00 PM (until 6:00 PM on the 19th) Venue: Pacifico Yokohama Exhibition Hall, Booth Number CM-18 <Exhibited Products> ■ Self-Localization & Environmental Mapping / Visual SLAM Solutions ■ Facility Monitoring Solutions ■ Bluetooth Solutions ■ Security Solutions for Embedded Systems ■ <Reference Exhibit> Combination Optimization Solutions for Embedded Systems <Exhibitor Seminar> Title: Further Evolution of Business Creation Utilizing Auracast Speaker: Toshiba Information Systems Corporation, Technology Division Bluetooth Executive Strategy Advisor, Katsumi Adachi, Ph.D. We will introduce the latest specifications of Bluetooth, technological trends such as Auracast, and the potential for application in new business ventures.
Notice of exhibiting wire cut electrical discharge machines at JIMTOF 2026, the 33rd event.
- Electric discharge machine
Announcement of exhibiting wire cut electrical discharge machines at JIMTOF 2026, the 33rd event.
- Electric discharge machine
65% reduction in arc time! 1.5 times yield rate! Significant cost savings possible due to excellent workability!
- Welding Machine
Accurate refueling is possible at 1 to 6 refueling points! It guarantees a high discharge pressure of 2.5 MPa.
- Other process controls
- Other industrial robots
Plastic injection molding / blow molding / insert molding / assembly / automation / sheet metal parts procurement / mold procurement / digitalization / IoT
- Injection Molding Machine
A claw changer that allows for the replacement of only the fingers with simple movements of a robotic arm!
- Articulated Robot
- Transport and handling robots
- Other industrial robots
Even though it's hand grinding, it is possible to control the grinding amount!
- Grinding Machine
Meticulous work unique to Japanese manufacturers! Detailed follow-up visits by sales representatives even after installation.
- Wafer processing/polishing equipment