List of Electronic Components products
- classification：Electronic Components
9241～9300 item / All 26776 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
No initial costs! Achieve heatstroke prevention affordably with a rental plan that includes property insurance.
- Other air conditioning equipment
- fan
- Other environmental equipment
Effective for heatstroke prevention and energy saving in summer! Rentals are also available.
【Measures Against Heat Stroke, Humidity, and Energy Conservation!】 In warehouses and factories with high ceilings, it is often difficult for air conditioning to circulate adequately due to the building's structure. Additionally, during this season, locations near the coast tend to have high humidity, which can cause cardboard to swell and affect products. To address these issues, it is common to increase air conditioning, but rising electricity costs are also a concern. For such environments, we recommend the introduction of "ceiling fans" and the application of "insulating and heat-reflective paint" to assist air conditioning. This helps to mitigate temperature increases from sunlight both inside and outside, protecting employees. JALOC is capable of providing both solutions, so please feel free to consult with us.
We measure the radial and axial displacements of turbines, compressors, etc. using a non-contact eddy current sensor.
- Sensors
![[DRAM Module] DDR4 2666MT/s Series](https://image.mono.ipros.com/public/product/image/a4b/2000349347/IPROS72764147398421402250.png?w=280&h=280){kind=small}
Embedded DRAM module - Achieved a 11.2% increase in transfer speed compared to conventional products.
- Other electronic parts
- Other semiconductors
- Memory
Innodisk's innovative lineup for industrial applications.
We would like to introduce Innodisk's diverse solutions. Introduction items: - Flash - DRAM - Embedded Peripherals - Software Solutions ---Please download the materials to see more--- This is just a small part of our offerings, so feel free to contact us.
Combination of inconspicuous tactile switches
- switch
- Other electronic parts
Attention those struggling with cost reduction and space-saving for flexible printed circuit boards (flexible substrates)! We can provide optimal proposals tailored to your needs!
- Other electronic parts
[Press Release from Taiyo TechnoRex] Regarding the Improvement of High-Density Wiring Formation Technology Using the Patterned Beer Fill Method
Our company has further improved the technology for forming high-density wiring in our core business of electronic substrates, specifically in flexible printed circuit boards (FPCs). In recent years, electronic devices such as medical equipment and industrial machinery have been advancing in miniaturization and lightweight design. To incorporate many functions into limited space, there is a demand for increased wiring density on the substrate. Therefore, we have been working on establishing filled via technology and improving the M-SAP method. The filled via structure involves filling vias (holes) made by laser in the insulating layer with copper plating, ensuring electrical connections on both sides of the substrate while reducing the recesses of the vias, which allows for component mounting on the vias and leads to high-density mounting. On the other hand, the M-SAP method significantly improves line width management by laminating copper to form circuits, enabling high-density wiring. This time, based on the pattern via fill method that leverages these characteristics, we successfully formed wiring with a pitch of 30μm on a double-sided substrate with a filled via structure. We will continue to aim for further improvements in high-density wiring formation technology through ongoing development, prototyping, and verification.
Supports over 50% elongation! There are various applications such as wearable electronic devices and robots.
- Other electronic parts
【TTL】Invisible wiring with transparent FPC! Compatible with reflow mounting, ideal for display devices such as digital signage. 【Flexible Printed Circuit Board】
Transparent flexible printed circuit boards contribute to improved design with excellent transparency! Fine patterns make the wiring less noticeable. 〇 Made with polyimide that excels in heat resistance and flame retardancy. ⇒ Compatible with reflow mounting. ★ Suitable for display devices such as digital signage, as well as medical devices and transparent film antennas! ★ We also accommodate small quantities and a variety of prototypes.
A bump with a minimum diameter of Φ20µm is formed at the terminal section of the FPC. The bump is used as a contact point and is applied in high-precision circuit testing, etc. (Flexible substrate)
- Other electronic parts
[Press Release from Taiyo TechnoRex] Regarding the Improvement of High-Density Wiring Formation Technology Using the Patterned Beer Fill Method
Our company has further improved the technology for forming high-density wiring in our core business of electronic substrates, specifically in flexible printed circuit boards (FPCs). In recent years, electronic devices such as medical equipment and industrial machinery have been advancing in miniaturization and lightweight design. To incorporate many functions into limited space, there is a demand for increased wiring density on the substrate. Therefore, we have been working on establishing filled via technology and improving the M-SAP method. The filled via structure involves filling vias (holes) made by laser in the insulating layer with copper plating, ensuring electrical connections on both sides of the substrate while reducing the recesses of the vias, which allows for component mounting on the vias and leads to high-density mounting. On the other hand, the M-SAP method significantly improves line width management by laminating copper to form circuits, enabling high-density wiring. This time, based on the pattern via fill method that leverages these characteristics, we successfully formed wiring with a pitch of 30μm on a double-sided substrate with a filled via structure. We will continue to aim for further improvements in high-density wiring formation technology through ongoing development, prototyping, and verification.
Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.
- Other electronic parts
[Press Release from Taiyo Techno Rex] Announcement regarding the launch of electronic device contract manufacturing services.
We have newly launched an "Electronics Manufacturing Services (EMS)" that provides a comprehensive response from material procurement, circuit design, manufacturing, and assembly to functional testing and shipping in the traditional FPC (Flexible Printed Circuit Board) manufacturing process. In recent years, the use of FPCs has expanded across various fields such as medical devices and industrial equipment, leading to an increased demand not only for supply but also for a one-stop solution that encompasses circuit design, module manufacturing, and even final product assembly. To meet these market demands, we have strengthened our collaboration with electronics manufacturing companies and established a manufacturing system that covers everything from material procurement to assembly. With this service, customers can reduce interactions with multiple vendors, achieve shorter lead times, and improve manufacturing efficiency. Our stringent quality control system ensures the delivery of highly reliable products. The product areas we can support include automotive devices, medical devices, industrial equipment, robotics, communication devices, lighting equipment, and home appliances, allowing us to meet a wide range of manufacturing needs.
Wide, low LED tactile push button switch with built-in RGB LED.
- switch
- Other electronic parts
We will measure the pulsating pressure of gas turbine combustors and similar devices.
- Sensors
We will measure vibrations in harsh environments.
- Sensors
You can select the oscillation frequency and use a wide range of output voltages.
- Other electronic parts
We recommend this for those looking for manufacturers that provide a stable supply of standard ICs!
- Other electronic parts
We recommend this for those looking for alternatives to discontinued or long-lead-time products.
- Other electronic parts
There are alternative products from domestic manufacturers, JSCJ's dual and compound semiconductors.
- Other electronic parts
Introducing various MOSFETs from JSCJ!
- Other electronic parts
Shunt regulator manufactured by Chinese major semiconductor company JSCJ.
- Other electronic parts
Replacement proposals for conventional products are possible! We offer Crystal, SPXO, and TCXO in sizes ranging from conventional specifications to compact models.
- Other electronic parts
Capacitive touch switch that operates with just a light touch of the finger.
- switch
A push-button switch that is easy to use and has a long lifespan, capable of withstanding over 100,000 presses.
- switch
An ultra-soft thermal conduction sheet that achieves excellent thermal conductivity. It fills the gaps of fine unevenness and efficiently conducts heat.
- Other electronic parts
- Other polymer materials
An ultra-soft thermal conduction sheet that achieves excellent thermal conductivity. It fills the gaps of fine unevenness and efficiently conducts heat.
- Other electronic parts
- Other polymer materials
An ultra-soft thermal conductive sheet that achieves excellent thermal conductivity. It fills the gaps of fine unevenness and efficiently conducts heat.
- Other electronic parts
You can select the input voltage and oscillation frequency!
- Other electronic parts
Total height 27mm, fanless heat sink cooler with a copper core heat sink with heat pipes and aluminum fins.
- Other electronic parts
We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)
- Other electronic parts
- Printed Circuit Board
- Circuit board design and manufacturing
Experience Taiyo Technorex's FPC at Flex's social study tour, Nepcon Japan 2025!
◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We have live demonstrations of 'FA Automation' and the latest appearance inspection system using AI technology! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed operation. We have prepared a demonstration for the transport of rigid boards. ◎The latest final appearance inspection system, the AI system 'TY-VISION XAIS,' is now in Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with minimal brightness differences that are difficult to detect with inspection devices, even though they can be identified visually.
Supports from small quantities to mass production. UL compliant, bendable processing available, compatible pitch: 0.5 to 2.54 mm, cable length: up to 1,000 mm.
- Printed Circuit Board
- cable
- Other cable related products
Let's detect pressure and center of gravity! Here is an introduction to surface pressure sensors.
- Sensors
- Sensors
Press Release from Taiyo TechnoRex: Participation in Wakayama Prefecture's "Space Town Development Promotion Project"
Our company has decided to participate in the "Space Town Development Promotion Project (Kii Space HUB)," which aims to create new industries and revitalize the region with a space theme, promoted by Wakayama Prefecture, in our core business of electronic substrate. Taking this opportunity, we will actively advance our technological development and business enhancement in the space field. The Space Town Development Promotion Project is a project aimed at the accumulation of the space industry, human resource development, and regional revitalization in Wakayama Prefecture, where the private rocket launch site "Spaceport Kii" is located, and it has garnered national attention. We aim to contribute to the lightweight and high functionality of space equipment by leveraging the manufacturing technologies of flexible printed circuit boards and electroforming that we have cultivated so far. In the future, we will actively engage in human resource development for those involved in the space business, starting with the provision of technology for satellite-mounted equipment and communication modules. We will also consider collaboration with private space companies, promoting value creation and business development in this new field of the space industry, while striving to balance technological innovation and social contribution, and continuing our challenges toward realizing a sustainable future.
![[Data Presentation] FPC Terminology...](https://image.mono.ipros.com/public/product/image/791/2000888908/IPROS16631666073025694825.png?w=280&h=280){kind=small}
We have compiled terms used in meetings related to FPC manufacturing. Please use it as an introductory mini-dictionary and an offline search tool.
- Printed Circuit Board
Press Release from Taiyo TechnoRex: Participation in Wakayama Prefecture's "Space Town Development Promotion Project"
Our company has decided to participate in the "Space Town Development Promotion Project (Kii Space HUB)," which aims to create new industries and revitalize the region with a space theme, promoted by Wakayama Prefecture, in our core business of electronic substrate. Taking this opportunity, we will actively advance our technological development and business enhancement in the space field. The Space Town Development Promotion Project is a project aimed at the accumulation of the space industry, human resource development, and regional revitalization in Wakayama Prefecture, where the private rocket launch site "Spaceport Kii" is located, and it has garnered national attention. We aim to contribute to the lightweight and high functionality of space equipment by leveraging the manufacturing technologies of flexible printed circuit boards and electroforming that we have cultivated so far. In the future, we will actively engage in human resource development for those involved in the space business, starting with the provision of technology for satellite-mounted equipment and communication modules. We will also consider collaboration with private space companies, promoting value creation and business development in this new field of the space industry, while striving to balance technological innovation and social contribution, and continuing our challenges toward realizing a sustainable future.
Surface treatment using plating to prevent light reflection, enabling ultra-fine processing at the micron level! It is widely applied in fields such as electronic components and semiconductors.
- Printed Circuit Board
【TTL】Microfabrication technology! Applying techniques such as electroplating, silicon etching, and glass etching to the development of various advanced technologies!
Microfabrication technology (photofabrication) plays an important role as a production technology, producing precision machined components such as lead frames, HDD suspensions, encoders, TAB tapes, various filters, and decorative items. Additionally, based on photofabrication technology, current advanced technologies such as printed circuit boards, photomasks for LSI, color filters for color liquid crystal display devices, and semiconductors are also being developed. [Source: Photofabrication Association - Technical Explanation]
Ultra-fine processing at the micron level is possible! It is widely applied in fields such as electronic components and semiconductors.
- Printed Circuit Board
Press Release from Taiyo TechnoRex: Participation in Wakayama Prefecture's "Space Town Development Promotion Project"
Our company has decided to participate in the "Space Town Development Promotion Project (Kii Space HUB)," which aims to create new industries and revitalize the region with a space theme, promoted by Wakayama Prefecture, in our core business of electronic substrate. Taking this opportunity, we will actively advance our technological development and business enhancement in the space field. The Space Town Development Promotion Project is a project aimed at the accumulation of the space industry, human resource development, and regional revitalization in Wakayama Prefecture, where the private rocket launch site "Spaceport Kii" is located, and it has garnered national attention. We aim to contribute to the lightweight and high functionality of space equipment by leveraging the manufacturing technologies of flexible printed circuit boards and electroforming that we have cultivated so far. In the future, we will actively engage in human resource development for those involved in the space business, starting with the provision of technology for satellite-mounted equipment and communication modules. We will also consider collaboration with private space companies, promoting value creation and business development in this new field of the space industry, while striving to balance technological innovation and social contribution, and continuing our challenges toward realizing a sustainable future.
From high-frequency applications to the design, manufacturing, evaluation testing, and analysis reports of flexible printed circuit boards with various characteristics!
- Printed Circuit Board
【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'
◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots
Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniq...
- Printed Circuit Board
- Circuit board design and manufacturing
【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'
◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots
We welcome inquiries and consultations regarding flexible procurement challenges! We respond to various requests, including halogen-free types. We cater to everything from digital cameras to the aeros...
- Printed Circuit Board
- Circuit board design and manufacturing
- Other electronic parts
【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'
◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots
Introduction to high-difficulty FPCs, specific issues, and TAIYO's one-stop service, covering the basics of flexible substrates (glossary)!
- Printed Circuit Board
- Other cable related products
- Other electronic parts
【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'
◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots
Analyzing the glow of fireflies and reproducing it with LEDs. Creating a soothing space.
- Lamps and light emitting devices
Wide temperature resistance, customizable to your desired frequency.
- Other electronic parts
Reliable performance with a fan made by Sanyo Electric, featuring a heat sink with copper columns and aluminum fins for the CPU cooler.
- Other electronic parts
Reliable performance with a fan made by SANYO Electric, featuring a heat sink with copper columns and aluminum fins for the CPU cooler.
- Other electronic parts
Total height 63.4mm, supports TDP 95W, CPU cooler with copper column and aluminum fins.
- Other electronic parts
Full height 26.5mm, supports TDP 95W, all-copper Skyb heat sink CPU cooler.
- Other electronic parts
Total height 45.4mm, supports TDP 35W, all-aluminum heat sink CPU cooler.
- Other electronic parts
Total height 63.4mm, supports TDP 65W, CPU cooler with all-aluminum heatsink.
- Other electronic parts
Total height 45.4mm, supports TDP 65W, CPU cooler with copper column and aluminum fins.
- Other electronic parts
Adaptable to various applications from pressure calibration in harsh environments.
- Sensors
Supports up to 40 MPa and can be manufactured in any range.
- Sensors
![[Technical Information] A Talk for ...](https://image.mono.ipros.com/public/product/image/c0e/2000458122/IPROS12277042230142908469.jpeg?w=280&h=280){kind=small}
Technical materials are provided to help understand coils, including the differences between coils and inductors.
- Inductor Coil
![[Information] A Discussion for Peop...](https://image.mono.ipros.com/public/product/image/e24/2000458128/IPROS75340997697861953314.jpeg?w=280&h=280){kind=small}
Published a technical column to help understand coils, including coil polarity and current standards.
- Inductor Coil
What is the principle of a coil? Here is an introductory material that helps you understand the basics of coils that you may be hesitant to ask about now.
- Inductor Coil
Explaining the image of radio wave transmission and reception using coils! I will explain "radio wave transmission and reception."
- Inductor Coil
I will explain in detail about the filter that works due to the coil.
- Inductor Coil
I will explain in detail about voltage conversion due to the operation of a coil.
- Inductor Coil
I will explain in detail about the noise removal due to the operation of the coil.
- Inductor Coil
I will explain what a coil is so that you can understand it.
- Inductor Coil
We specialize in the implementation of a small number of diverse printed circuit boards.
- Printed Circuit Board
This is an antenna specially designed for IoT devices equipped with a small ground plane.
- antenna