List of For Techies products
- classification：For Techies
796～810 item / All 4498 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
What I focused on was "effectiveness." English conversation lessons anytime at home or during free time.
- Distance learning/E-learning
- Vocational Training/Technical School
Truly, language skills that can compete globally! The only one-stop solution you can count on is Lingage.
- Distance learning/E-learning
- Vocational Training/Technical School
As a registered support organization, we have abundant know-how in supporting Japanese language learning for foreign workers with specified skills!
- Vocational Training/Technical School
A thorough explanation of semiconductor packaging from the basics to applications!
- Other semiconductors
- others
- Technical and Reference Books
5/15 Webinar "Changes in Joint Structures and Packaging Solutions Due to the Evolution of Semiconductors"
■ Title: "Changes in Joint Structures and Packaging Correspondence Due to the Evolution of Semiconductors - Response of Resin Sealing Technology to the Increase in the Number of Joint Locations and Narrow Spacing -" ――Organizing the core of joint design and sealing technology essential for the WLP and 3D assembly era. Covering failure mechanisms and countermeasures associated with high integration, providing insights directly related to development, evaluation, and mass production challenges. ■ Date and Time: May 15, 2026 (Friday) 13:00 - 16:30 ■ Zoom Streaming (with materials) 【Knowledge Gained from the Seminar】 - Development history and trends of semiconductor packaging - Changes in semiconductor joint structures and the current status of packaging technology - Evolution of semiconductor packaging and the development history, challenges, and countermeasures of resin sealing technology 【Target Audience for the Seminar】 - Stakeholders in the semiconductor-related fields (sales, technical positions, etc.) - Individuals interested in semiconductor manufacturing technology (front-end, back-end, etc.) - Those interested in the evolution of semiconductor packaging and the corresponding packaging technology - Individuals interested in semiconductor integration = bonding technology (Bumping Technology)
A detailed explanation of the highly regarded porous metal-organic framework (MOF) from the basics to the latest research! Includes on-demand viewing!
- Technical Seminar
- Distance learning/E-learning
- Other polymer materials
Publishing know-how on resin molding, mold technology, and CAE analysis. Free distribution campaign for gas vent parts [SG-WIND] for the first 100 site members who register!
- Technical and Reference Books
- Other molds
- Other analyses
How to check for the presence of invisible ion residues! Introducing cleaning know-how.
- Technical and Reference Books
Here are some points to consider when contemplating flux cleaning!
- Technical and Reference Books
Let's work together to nurture IT talent in Japan! Shall we remove economic barriers and educational filters to cultivate talented students?
- Vocational Training/Technical School
- Other services
To cultivate talent that can be immediately effective, we have introduced a unique learning method designed to align with the work of engineers!
- Vocational Training/Technical School
- Other services
![[Web Seminar] Proposal for Energy S...](https://image.mono.ipros.com/public/default/object/noimage_l.gif?w=280&h=280){kind=small}
Web seminar to achieve "energy saving" and "efficiency" by reviewing the air blow process.
- Technical Seminar
Streamline new employee training with VR training that is not affected by equipment operation! Training in a realistic virtual space is effective for reducing OJT time and improving safety.
- Vocational Training/Technical School
![[Book] Latest Trends in Next-Genera...](https://image.mono.ipros.com/public/product/image/4e2/2000843961/IPROS94359181706370988166.jpeg?w=280&h=280){kind=small}
Technical Specialized Books: 2.XD, 3D Integration and Substrate Materials, Encapsulation and Bonding Technology, Heat Dissipation Materials.
- others
- Technical and Reference Books
- Technical and Reference Books
[Book] Latest Trends in Next-Generation Semiconductor Packaging and the Development of Its Materials and Processes (No. 2197BOD)
- 2.XD, 3D integration and substrate materials, encapsulation and bonding technologies, heat dissipation materials - －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Advanced Semiconductor Package Technologies and Their Structures, Process Technologies Chapter 2: Implementation Technologies and Heat Dissipation Measures for Next-Generation Power Semiconductors Chapter 3: Design of Semiconductor Encapsulation Materials, Required Characteristics, and Characteristic Improvement Technologies Chapter 4: Adhesion, Bonding Technologies, and Reliability Evaluation in Semiconductor Packaging Chapter 5: Material Technologies for Printed Circuit Boards and Wiring Formation, Processing Technologies Chapter 6: Development Trends of Thermal Management Materials and Thermal Property Evaluation Chapter 7: Analysis and Inspection Technologies for Semiconductor Packages －－－－－－－－－－－－－－－－－－－－－－－－－－ ● Published: April 28, 2023 ● Authors: 56 ● Format: A4 size, 613 pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-945-4 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available Price: 69,300 yen (tax included) ISBN: 978-4-86798-105-4 After receiving your order, we will perform simple printing and binding. －－－－－－－－－－－－－－－－－－－－－－－－－－
![[Book] Low-Temperature and Low-Pres...](https://image.mono.ipros.com/public/product/image/70b/2000866899/IPROS3636881463371498756.gif?w=280&h=280){kind=small}
Technical Specialized Books - Combustion and Co-combustion Technology, Hydrogen Carriers
- others
- Technical and Reference Books
- Technical and Reference Books
[Book] Low-Temperature and Low-Pressure Synthesis of Ammonia and New Utilization Technologies (No. 2199BOD)
■Table of Contents Chapter 1: Positioning of Ammonia as a Decarbonization and Green Growth Strategy Chapter 2: Characteristics of Ammonia (Blue Ammonia and Green Ammonia) Chapter 3: Development of Catalysts for Ammonia Synthesis and Production Efforts Chapter 4: Ammonia Synthesis and Production Technologies from Wastewater and Sewage Chapter 5: Combustion and Co-firing Technologies for Ammonia Fuel – Thermal Power Generation, Boilers, Industrial Furnaces, Gas Turbines – Chapter 6: Utilization and Combustion Technologies of Ammonia in Diesel Engines Chapter 7: Utilization Technologies of Ammonia as a Hydrogen Carrier Chapter 8: Efforts to Build a Supply Chain for the Spread of Ammonia －－－－－－－－－－－－－－－－－－－－－－－－－－ ●Publication Date: May 31, 2023 ●Authors: 73 ●Format: A4, 448 pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-953-8 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available Price: 69,300 yen (tax included) ISBN: 978-4-86798-104-7 After receiving your order, we will perform simple printing and binding. －－－－－－－－－－－－－－－－－－－－－－－－－－
![[Book] Implementation of Accelerate...](https://image.mono.ipros.com/public/product/image/f24/2000900196/IPROS4698621632968780825.gif?w=280&h=280){kind=small}
★ Lifespan prediction from sparse data and small data! What is the new method to improve accuracy?
- others
- Technical and Reference Books
- Technical and Reference Books
[Book] Implementation of Accelerated Testing and Product Life Prediction Using Models (No. 2201BOD)
■Table of Contents <Excerpt> Chapter 1: Planning Accelerated Tests, Conditions, and Utilizing Acceleration Models Chapter 2: Weibull Analysis Made Easy for Beginners Chapter 3: Methods for Calculating Coefficients Used in Lifetime Prediction Models Chapter 4: How to Present and Read Plots of Lifetime Prediction Models Chapter 5: Types of Accelerated Test Equipment, How to Choose and Use Them Chapter 6: Accelerated Testing of Electronic Components and Batteries Chapter 7: Accelerated Testing of Resins, Rubbers, and Various Materials Chapter 8: Accelerated Testing of Pharmaceuticals, Cosmetics, and Food Chapter 9: Development of New Accelerated Tests, Accuracy Improvement, and Lifetime Estimation Methods Chapter 10: Methods for Acquiring Data for Lifetime Estimation and Degradation Analysis －－－－－－－－－－－－－－－－－－－－－－－－－－ ●Publication Date: June 30, 2023 ●Authors: 55 ●Format: A4 Size, 555 Pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-955-2 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available Price: 69,300 yen (tax included) ISBN: 978-4-86798-094-1 After receiving your order, we will perform simple printing and binding. －－－－－－－－－－－－－－－－－－－－－－－－－－