List of For Techies products
- classification：For Techies
976～990 item / All 4638 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Reproducing disaster scenarios in virtual space (VR). Contributing to the prevention of work-related accidents. "Falls from Tripping (Cords on the Pathway)"
- Technical Seminar
Notice of participation in "IT Trend EXPO 2026 Spring" (the largest online exhibition in Japan) from March 3 (Tue) to March 7 (Sat).
Notice of participation in the "IT Trend EXPO 2026 Spring" (the largest online exhibition in Japan) from March 3 (Tue) to March 7 (Sat). ◆ IT Trend EXPO 2026 Spring Event Overview ◆ Name: IT Trend EXPO 2026 Spring Theme: New encounters will change tomorrow's "work" Date: March 3 (Tue) - 7 (Sat), 2026 Location: Online Participation Fee: Free Registration: Please apply from the URL below Meiden VR Safety Experience Education: https://it.expo.it-trend.jp/key/xpgi2xce Safety Information Portal: https://it.expo.it-trend.jp/key/3r6vr3bw
Reproducing disaster scenarios in virtual space (VR). Contributing to the prevention of work-related accidents. "Falls from Tripping (Sagging Mat)"
- Technical Seminar
Notice of participation in "IT Trend EXPO 2026 Spring" (the largest online exhibition in Japan) from March 3 (Tue) to March 7 (Sat).
Notice of participation in the "IT Trend EXPO 2026 Spring" (the largest online exhibition in Japan) from March 3 (Tue) to March 7 (Sat). ◆ IT Trend EXPO 2026 Spring Event Overview ◆ Name: IT Trend EXPO 2026 Spring Theme: New encounters will change tomorrow's "work" Date: March 3 (Tue) - 7 (Sat), 2026 Location: Online Participation Fee: Free Registration: Please apply from the URL below Meiden VR Safety Experience Education: https://it.expo.it-trend.jp/key/xpgi2xce Safety Information Portal: https://it.expo.it-trend.jp/key/3r6vr3bw
Recreating disaster scenarios in virtual space (VR). Contributing to the prevention of occupational accidents. "Obstacles on the path to falling from tripping."
- Technical Seminar
Notice of participation in "IT Trend EXPO 2026 Spring" (the largest online exhibition in Japan) from March 3 (Tue) to March 7 (Sat).
Notice of participation in the "IT Trend EXPO 2026 Spring" (the largest online exhibition in Japan) from March 3 (Tue) to March 7 (Sat). ◆ IT Trend EXPO 2026 Spring Event Overview ◆ Name: IT Trend EXPO 2026 Spring Theme: New encounters will change tomorrow's "work" Date: March 3 (Tue) - 7 (Sat), 2026 Location: Online Participation Fee: Free Registration: Please apply from the URL below Meiden VR Safety Experience Education: https://it.expo.it-trend.jp/key/xpgi2xce Safety Information Portal: https://it.expo.it-trend.jp/key/3r6vr3bw
![[VR Safety Experience Education] Li...](https://image.mono.ipros.com/public/product/image/26d/2000850446/IPROS9580073024892508222.png?w=280&h=280){kind=small}
[VR Safety Experience Education] List of VR Content
- Technical Seminar
We will exhibit at the 12th Labor Safety and Health Exhibition from July 23 (Wednesday) to July 25 (Friday).
Exhibition Name: 12th Labor Safety and Health Exhibition Date: July 23, 2025 (Wednesday) - July 25, 2025 (Friday) Time: 10:00 AM - 5:00 PM Venue: Tokyo Big Sight, East Exhibition Hall 7-G09 Organizer: Japan Management Association Exhibition Content: 【3-Axis VR Simulator】 --Experience dangers that cannot be encountered in real life safely-- Experience potential labor accidents that could occur at construction sites with a wealth of content using a 3-axis VR simulator. 【Safety Information Portal】 --Efficiently collect and centralize information related to corporate safety and health-- This is a safety portal site that supports the management and improvement of safety and health (PDCA cycle). *You can experience it on the day of the event. Please note that there is a limit on the number of participants. Reservations are also possible, so please contact us.
Technologies for utilizing waste heat that achieve the decarbonization of energy use, which is becoming increasingly important!
- Other services
- Technical and Reference Books
![[Information] Introduction to OTA](https://image.mono.ipros.com/public/product/image/2108751/IPROS7349406134686855985.png?w=280&h=280){kind=small}
A detailed explanation of the mechanism of firmware updates and key points for security measures!
- Technical and Reference Books
Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!
- Technical and Reference Books
- Other semiconductors
8/5 Webinar: Semiconductor Packaging Technology Course
■Title "Changes in Joint Structures and Packaging Responses Due to the Evolution of Semiconductors ~ Response of Resin Sealing Technology to the Increase in the Number of Joints and Narrow Pitching ~" In semiconductor packages, which are advancing in high integration, high density, and three-dimensionality, addressing the increase in joints (bumps) and narrowing of pitches has become an important challenge. In this seminar, experienced instructors will organize the changes in joint structures accompanying the evolution of semiconductor packages and explain the latest trends, challenges, and countermeasures in resin sealing technology and mounting technology. 【Knowledge Gained from the Seminar】 - Development history and latest trends of semiconductor packaging - Changes in joint structures and packaging technology - Evaluation methods for resin sealing materials and sealing technology - Sealing technology for narrow pitch bumps and reliability improvement - Challenges and countermeasures in advanced packaging 【Target Audience】 Engineers, researchers, and sales representatives from semiconductor-related companies, as well as those involved in semiconductor manufacturing, mounting, sealing materials, and packaging technology.
No knowledge of cosmetics development is required! We are currently offering a checklist document summarizing key points to organize before your OEM consultation, from a sales perspective.
- Technical and Reference Books
We will respond to the call for 'I want effective technical education!' with the latest technology!
- Distance learning/E-learning
- Distance learning/E-learning
We will explain the tools and format templates developed in-house for quality improvement that can be used immediately on-site in a ZOOM online format.
- Technical Seminar
- Management Skills Seminar