List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
1561～1575 item / All 5127 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
Dip speed, ultra-low speed of 1 nanometer per second, achieving three-dimensional control!
- Coater
- Surface treatment contract service
- Other processing machines
Easy panel operation allows for the implementation of standard tests! A tester for conducting leakage current tests.
- Tester
High-spec compact coater compatible with various metals such as Ni, Cr, W, Ti, and Al!
- Sputtering Equipment
This is an ion coater ideal for full coating of large samples. Models are available for sizes ranging from 4 to 8 inches.
- Sputtering Equipment
Small film-forming device! It can simultaneously accommodate three types of targets.
- Coater
Uniform carbon deposition is now possible! Ideal for pretreatment in EPMA and analytical SEM.
- Evaporation Equipment
Customizable to fit experimental purposes. Small RF sputtering device.
- Sputtering Equipment
Fully automatic ion coater suitable for sample preparation for SEM.
- Sputtering Equipment
Full automatic sputter coater with magnetron cathode to reduce ion damage.
- Sputtering Equipment
San-Yu Electronics, sputtering devices, vacuum deposition equipment, SEM/electron microscope-related equipment.
- Coater
Compatible with Ni/Cr/W and more! Achieving high-precision control through software control.
- Coater
The definitive low-cost dispenser that maintains high precision! Significant increase in production efficiency with high-speed dispensing! Ideal for solving coating issues in manufacturing sites!
- Bonding Equipment
Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors
Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
Developing cylindrical polishing for SiC, which is expected to be the next-generation power semiconductor!
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
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The crystallization of technology! It is used in the process of making semiconductors found in smartphones.
- Plastic utensils and containers
- Other semiconductor manufacturing equipment
Built-in 10 types of polishing/etching conditions suitable for various materials! Short polishing time and high reproducibility.
- Wafer processing/polishing equipment
- Etching Equipment