List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

1606~1620 item / All 5076 items

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Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

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  • Other safety and hygiene products

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Amino acid-derived natural cationic polymer that can be used in food preservatives, hygiene materials, and daily necessities. It is a safe material as it is a fermentation product produced by natural ...

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  • Shelf life enhancer

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Introduction of the preservative polylysine / fermented polyamino acids that contribute to food poisoning prevention.

We provide easy-to-understand materials explaining the natural preservative polylysine, which prevents food poisoning. ε-Polylysine (hereafter referred to as polylysine) is an amino acid-derived preservative widely used as a food preservative. By adding polylysine, the growth of microorganisms that cause food poisoning can be prevented. Every year, food poisoning caused by microorganisms is a significant issue and is frequently reported in the news. Even foods that do not appear to be spoiled can rapidly proliferate microorganisms if the growth environment is suitable, so caution is necessary. Even if something looks clean, contamination by bacteria can progress, posing a risk of food poisoning. By ensuring hygiene management during the manufacturing process, proper storage at appropriate temperatures, and the appropriate use of the preservative polylysine, food safety can be more effectively protected. 【Features】 ■ A safe material produced through fermentation by natural microorganisms (not genetically modified organisms) ■ Provides a good image as a natural fermented product ■ Listed in the existing additive registry as a food preservative ■ A safe domestic product *Please feel free to contact us.

Eagle AERO is a high-throughput wire bonding device.

  • Bonding Equipment

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CoS (Chip on Submount) is a high-precision die/flip chip bonder.

  • Bonding Equipment

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ICA1205 is a multi-laser dicing device that employs a multi-beam structure.

  • Other semiconductor manufacturing equipment

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It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.

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  • Bonding Equipment

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AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.

  • Bonding Equipment

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Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.

  • Bonding Equipment

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We will introduce hand clean rolls made of silicone-based and non-silicone-based materials.

  • Other cleaning tools
  • Special labels, etc.
  • Evaporation Equipment

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Supports work widths of 255, 350, 450, 550, 600, and 750 mm!

  • Sputtering Equipment
  • Food Packaging Machinery
  • Beverage Production Equipment

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The CMX series is great news for those who had given up on web cleaners due to space constraints.

  • Coater
  • Vacuum Packaging Machine
  • Processing Contract

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Ideal for use in clean rooms! It is a fully automatic system for cleaning rolls.

  • Sputtering Equipment
  • Bag making machine/slitter
  • Special labels, etc.

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Supports work widths from 300 to 1500 mm! Single-sided and double-sided narrow applications.

  • Coater
  • Bag making machine/slitter
  • Processing Contract

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To customers considering wide-width equipment for roll-to-roll production lines.

  • Bag making machine/slitter
  • Injection Molding Machine
  • Semiconductor inspection/test equipment

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To customers considering ultra-wide equipment for roll-to-roll production lines.

  • Evaporation Equipment
  • Extrusion Machine
  • Food Packaging Machinery

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The ULT roll-to-roll web cleaner device stably removes dust even at a converting production line speed of 300m/min.

  • Sputtering Equipment
  • Bag making machine/slitter
  • Food Packaging Machinery

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"High-precision microfabrication" is a new method that achieves a balanced total of processing accuracy, productivity, compatible materials, and cost!

  • Wafer processing/polishing equipment

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