List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
1726～1740 item / All 5178 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!
- Other machine tools
We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!
Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)
![[Mold Prevention Measures] ~ Film C...](https://image.mono.ipros.com/public/product/image/34e/2001037961/IPROS05532312531430526084.jpeg?w=280&h=280){kind=small}
Rich experience in processing various materials and substrates! Effective sputtering technology for mold prevention as well.
- Sputtering Equipment
Various antibacterial/antiviral treatments, anti-mold, etc.! Sputtering processing on fibers and films.
- Sputtering Equipment
Rich experience in processing various materials and substrates! Substrate × thin film = optical adjustment, conductivity, antibacterial/antiviral.
- Sputtering Equipment
Multi-purpose vacuum deposition device HEX system RF & DC sputtering source
- Sputtering Equipment
Modular Structure Vacuum Device - Multi-Purpose Vacuum Deposition Device HEX Series - High Expandability & High Maintainability
The 'True Modular Structure' changes the common understanding of vacuum devices. A compact vacuum device with a minimum installation area of 60cm square, which can be introduced with a minimal configuration and allows for flexible changes in structure according to shifts in research direction. Traditionally, vacuum devices had a fixed number and arrangement of ports upon installation, making changes impractical. However, the HEX system, featuring a hexagonal prism-shaped chamber, adopts a groundbreaking 'modular structure' that allows for the number and arrangement of ports to be freely changed by swapping out the panels that make up each side. This enables easy configuration changes and functional expansions, akin to assembling blocks, in response to changes in research direction. ◆ The 'Modular Structure' allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Capable of simultaneous film deposition from multiple sources ◆ Supports sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes *Please feel free to contact us for more details.
Resistance heating evaporation source for the multi-purpose vacuum deposition device HEX system.
- Sputtering Equipment
Modular Structure Vacuum Device - Multi-Purpose Vacuum Deposition Device HEX Series - High Expandability & High Maintainability
The 'True Modular Structure' changes the common understanding of vacuum devices. A compact vacuum device with a minimum installation area of 60cm square, which can be introduced with a minimal configuration and allows for flexible changes in structure according to shifts in research direction. Traditionally, vacuum devices had a fixed number and arrangement of ports upon installation, making changes impractical. However, the HEX system, featuring a hexagonal prism-shaped chamber, adopts a groundbreaking 'modular structure' that allows for the number and arrangement of ports to be freely changed by swapping out the panels that make up each side. This enables easy configuration changes and functional expansions, akin to assembling blocks, in response to changes in research direction. ◆ The 'Modular Structure' allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Capable of simultaneous film deposition from multiple sources ◆ Supports sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes *Please feel free to contact us for more details.
Multi-purpose vacuum deposition device for HEX system with 1-source and 4-source electron beam deposition sources.
- Sputtering Equipment
Modular Structure Vacuum Device - Multi-Purpose Vacuum Deposition Device HEX Series - High Expandability & High Maintainability
The 'True Modular Structure' changes the common understanding of vacuum devices. A compact vacuum device with a minimum installation area of 60cm square, which can be introduced with a minimal configuration and allows for flexible changes in structure according to shifts in research direction. Traditionally, vacuum devices had a fixed number and arrangement of ports upon installation, making changes impractical. However, the HEX system, featuring a hexagonal prism-shaped chamber, adopts a groundbreaking 'modular structure' that allows for the number and arrangement of ports to be freely changed by swapping out the panels that make up each side. This enables easy configuration changes and functional expansions, akin to assembling blocks, in response to changes in research direction. ◆ The 'Modular Structure' allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Capable of simultaneous film deposition from multiple sources ◆ Supports sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes *Please feel free to contact us for more details.
We deliver components such as fasteners made from Taiwanese engineering plastics.
- Other semiconductor manufacturing equipment
Metal contaminant-free dielectric lining! A compact ECR atomic beam source compatible with ultra-high vacuum equipment.
- Electron beam lithography equipment
Conductive fluoropolymer coating for components that require high operating temperatures, non-stick properties, and chemical resistance.
- Etching Equipment
This is a coating that imparts conductivity to fluororesin. It prevents charging and can proactively prevent issues caused by static electricity.
- Etching Equipment
This is a coating that imparts conductivity to fluororesin. It prevents charging and can proactively prevent issues caused by static electricity.
- Etching Equipment
Easy discharge operation! Compact design with automatic matching for RF power supply.
- Sputtering Equipment
Reduce initial implementation costs and enable high performance through expansion! Upgrade according to the research stage.
- Sputtering Equipment
"High-precision support frame for semiconductor devices" and "base frame for ultrasonic testing equipment" are included!
- Contract manufacturing
- Other contract services
- Other semiconductor manufacturing equipment
![[Example] Semiconductor manufacturi...](https://image.mono.ipros.com/public/product/image/99f/2000848816/IPROS46943275180423824057.png?w=280&h=280){kind=small}
The joints between the square pipes are processed to maintain strength through full circumferential welding!
- Contract manufacturing
- Other contract services
- Other semiconductor manufacturing equipment