List of Semiconductor Manufacturing Equipment products

Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

• air conditioning

Many delivery achievements! Standard centerless grinding machine suitable for polishing pipes and bar materials.

• Wafer processing/polishing equipment
• Hand polishing and filing

Consistent processing from rough grinding to finishing! Four-head cylindrical grinding machine compatible with long workpieces.

• Wafer processing/polishing equipment
• Hand polishing and filing

Widely available! A belt sander that allows for easy belt replacement.

• Wafer processing/polishing equipment
• Hand polishing and filing

Achieves excellent grinding efficiency due to wet processing! Polishing is also possible with buff specifications!

• Wafer processing/polishing equipment
• Hand polishing and filing

A cyclone and filter in one unit! A dust collector with low filter dust load.

• Wafer processing/polishing equipment
• Hand polishing and filing

Excellent dust removal efficiency! For dust during the recovery of raw materials such as flour, confectionery, stone dust, and precious metals!

• Wafer processing/polishing equipment
• Hand polishing and filing

Strong dust collection power, high dust collection efficiency, stable suction power! A dust collector that can be used for various applications.

• Wafer processing/polishing equipment
• Hand polishing and filing

Air supply on-off manual operation non-contact wafer tweezers

• Other physicochemical equipment
• Semiconductor inspection/test equipment
• Image Processing Equipment

Automatic device for reducing warpage of thin wafers after back grinding, capable of outer circumference cutting after tape application.

• Wafer processing/polishing equipment

Leave semiconductor manufacturing equipment and LCD manufacturing equipment to us.

• Other semiconductor manufacturing equipment

Bernoulli chuck "Float Chuck SAC type" adopting a gas vertical jet method that reduces airflow friction loss.

• Wafer
• Other semiconductor manufacturing equipment
• Wafer

Non-contact transport of ultra-thin glass substrates with a thickness of 50μm - Non-contact transport device "50μm Thick Ultra-Thin Glass Non-Contact Transport Device LNAS Type"

• Stepper

This is a bonding tool made using single crystal diamond. It has excellent thermal conductivity and wear resistance at high temperatures.

• Other semiconductors
• Bonding Equipment
• PCB terminal blocks

Leave it to us for all your semiconductor testing-related products.

• Semiconductor inspection/test equipment

Reduce friction resistance and achieve smooth operation! For the inner diameter of large bearings and the friction parts of sliding FA equipment! Ishida Polishing's polishing technology.

• Processing Contract
• Hand polishing and filing
• Wafer processing/polishing equipment