List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

541~585 item / All 5107 items

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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

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  • air conditioning

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The mid-infrared wavelength tunable laser OPPO MIR is a picosecond pulse laser that can be adjusted in the wavelength range of 2.8 to 4.2 µm, with a maximum output of over 1W.

  • Etching Equipment

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266nm CW (continuous wave) laser 10mW - 550mW @ 266nm Compact head Air-cooled, low noise

  • Semiconductor inspection/test equipment

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Compatible with high aspect ratio TGV/TSV. The world's largest chamber size for ALD (1000mm□).

  • Other semiconductor manufacturing equipment
  • Plasma surface treatment equipment
  • Surface treatment contract service

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It is said to be difficult in ALD, but it is possible to form a powder film at low temperature (room temperature) and atmospheric pressure!

  • Plasma surface treatment equipment
  • Surface treatment contract service
  • Other semiconductor manufacturing equipment

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A lineup including tube skimmers, disc skimmers, and optional quick attachment devices!

  • Wafer processing/polishing equipment
  • Other processing machines

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Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.

  • Bonding Equipment

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Expansion of productivity! The large work area allows for batch processing of multiple devices.

  • Bonding Equipment

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A controllable current transducer and frequency that continuously monitors wire deformation.

  • Bonding Equipment

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Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.

  • Bonding Equipment

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Automation of rough to finish machining of complex shapes without robot teaching! Contributing to labor reduction, time savings, and increased productivity in the polishing process. Test machining cur...

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  • Wafer processing/polishing equipment

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Substrate transport case for LCD (Liquid Crystal Display) and OLED (Organic EL) GHB-6755

  • Other conveying machines
  • Other semiconductor manufacturing equipment
  • Packaging materials

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Substrate transport case for LCD (Liquid Crystal Display) and OLED (Organic EL) G130

  • Other conveying machines
  • Other semiconductor manufacturing equipment
  • Packaging materials

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A wide variety of options are available, including types that maintain cleanliness levels below Class 100 and those compatible with large glass substrates.

  • Other conveying machines
  • Other semiconductor manufacturing equipment

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Substrate transport case for LCD (Liquid Crystal Display) and OLED (Organic EL) PG-V3-1180-1860

  • Other conveying machines
  • Other semiconductor manufacturing equipment
  • Packaging materials

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All-in-one case for substrate transport (Alpoly case)

  • Other conveying machines
  • Other semiconductor manufacturing equipment
  • Packaging materials

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Non-contact up to G8! Our "Case Management System" allows for Eco Mark acquisition, making storage and maintenance convenient.

  • Other conveying machines
  • Other semiconductor manufacturing equipment
  • Packaging materials

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Substrate transport case for LCD (Liquid Crystal Display) and OLED (Organic EL) GHB-8868

  • Other conveying machines
  • Other semiconductor manufacturing equipment
  • Packaging materials

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Bag-type substrate transport case for LCD (Liquid Crystal Display) and OLED (Organic EL).

  • Other conveying machines
  • Other semiconductor manufacturing equipment
  • Packaging materials

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We offer polishing processing services for various glass materials.

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  • Glass
  • Processing Contract
  • Wafer processing/polishing equipment

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We consolidate foundational technologies and know-how related to photoresist materials, which are essential for semiconductors, displays, printed circuit boards, and more.

  • Resist Device
  • Other semiconductors
  • LCD display

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Disco SPR-101 Robot System Modification

  • Other semiconductor manufacturing equipment

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A valve compatible with an integrated gas system that can be used with various gases in high-temperature environments (up to 200°C).

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  • Other semiconductor manufacturing equipment
  • valve
  • Pipe Fittings

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Introducing fittings that ensure reliable fastening power through our unique structure! Designed for ease of use, they can be detached and reattached even after piping installation.

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  • Other semiconductor manufacturing equipment
  • valve
  • Pipe Fittings

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High-speed opening and closing with high response stability! Capable of accommodating special face-to-face dimensions, valve shapes, and corrosion-resistant material bodies.

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  • Other semiconductor manufacturing equipment
  • valve
  • Pipe Fittings

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One unit compatible with LIV·EA·spectrum — fully automatic, ultra-high efficiency tester, essential for mass production.

  • Tester

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A smart test system optimized for mass production screening of silicon photonics.

  • Tester

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Overwhelming mass production capability at 4000 UPH. Automatic for dynamic, static, and high-temperature conditions.

  • Tester

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Introducing a 21-megapixel CoaXPress-over-Fiber (CoF) camera that supports image transmission at up to 100 Gbps!

  • Semiconductor inspection/test equipment

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Compatible with SFP112/QSFP112! Can be mounted in the compact FTB-1 HPDC chassis.

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  • Tester

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Customize the optical integrated circuit you want to measure! Introducing our testing solutions.

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  • Tester

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Starting the 800GbE point-to-point test, also supporting breakout tests with 2x400GbE and 8x100GbE!

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  • Tester

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A modular measurement platform for testing optical passive components 24 hours a day, 365 days a year!

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  • Tester

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Full support for testing transmission standards of 800G/400G/200G/100G!

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  • Tester

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Customize the optical integrated circuit you want to measure! It can also be used for spectral analysis and functional testing.

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  • Semiconductor inspection/test equipment

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Air bearing cylinder with zero friction resistance.

  • Pneumatic Equipment
  • Bonding Equipment
  • Wafer processing/polishing equipment

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Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition

We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee

Non-contact, high-speed response allows for control as you wish. Custom orders are available starting from one unit!

  • Pneumatic Equipment
  • Bonding Equipment
  • Wafer processing/polishing equipment

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Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition

We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee

Expansion to advanced packages: Processing is possible on a 510×515mm substrate.

  • Sputtering Equipment
  • Etching Equipment
  • Annealing furnace

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Polish with just water! Improve productivity by reducing labor! Remove rust and dirt too!

  • Hand polishing and filing
  • Grindstone
  • Wafer processing/polishing equipment

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100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

TGV Glass Microfabrication Technology LIDE (Laser Induced Deep Etching)

  • Other semiconductor manufacturing equipment

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Invitation to Exhibit at the Microwave Exhibition 2025

Microwave Exhibition 2025 Exhibition Overview 【Dates】November 26 (Wednesday) - 28 (Friday), 2025, 10:00-17:00 【Venue】Pacifico Yokohama Exhibition Hall 【Our Booth】Exhibition Hall D M-08 ■ Products from LPKF Laser & Electronics ■ 【Exhibits】 - High-frequency application circuit board processing machine "LPKF ProtoMat S104" A specialist for high-frequency and microwave applications. It is equipped with all the functions necessary for PCB prototyping. - LPKF glass micro-processing LIDE technology "Vitrion series" processing samples Micro-hole drilling of glass using LIDE technology = The LIDE method modifies the glass with a laser and then generates holes through an etching process, achieving a safe method without micro-cracks or chipping. Please click the related link below for pre-registration ☟ *Pre-registration is required for attendance. Feel free to reach out for technical consultations. We sincerely look forward to your visit. October 2025 Brooks Japan Co., Ltd. Contact: Toyama, Isobe

We have various types available, including high-load types and those that can be fixed to walls.

  • Workstation
  • Semiconductor inspection/test equipment
  • Desktop PC

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You can individually or simultaneously switch the negative pressure of the airway ON/OFF.

  • Vacuum Equipment
  • Sealing
  • Other semiconductor manufacturing equipment

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