List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
631～675 item / All 4977 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
A belt grinding machine that has been in use for about 50 years since 1973. In addition to trust and proven results, the lineup is also extensive.
- Other machine tools
Belt grinding machine "Veda Machine" has high durability and a wide range of service parts.
The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each individual unit. By selecting models and types according to the shape and size of the workpiece, and by equipping it with a polishing belt suitable for the task, it can flexibly accommodate a wide variety of items across various fields. Please make extensive use of it for high-efficiency polishing and grinding, reduction of work time, labor-saving, and standardization of tasks. 【Lineup】 ■ Portable type BP-K (air motor type) ■ Made-to-order machine PC-1 (wheel centerless), BC (standard dust cover) ■ Installed type BM (basic type), SBA-1, BH-2 ■ Wheel type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.
Save cleaning time! The durable die-cast body provides robustness and stability.
- Wafer processing/polishing equipment
Introducing an automatic polishing machine with a total weight of 77kg, available with an optional splash kit and lid!
- Wafer processing/polishing equipment
Leave it to us for anything related to plating!
- Other semiconductor manufacturing equipment
- Surface treatment contract service
- Processing Contract
New emotions with "Tonari"! Semiconductor solutions that fulfill "I want to do this."
- Other semiconductor manufacturing equipment
- Recruitment business
Sales of aluminum frames up to 5800 mm are possible! Additionally, we also accept "assembled products" such as exterior booths! Compatibility with other companies is also available.
- Other assembly machines
- CVD Equipment
- aluminum
Using sputtering technology in a medium vacuum environment, we have developed the world's first plating seed layer formation technology through direct copper deposition! Achieving productivity beyond ...
- Sputtering Equipment
Just install the GEM module between the device and the host!
- Communications
- Other semiconductor manufacturing equipment
Minimal shape change and high gloss! Achieve polishing of metals for jewelry, dental, and industrial applications with a tabletop-sized special electrolytic polishing machine!
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- Wafer processing/polishing equipment
It is possible to perform grinding on corner R surfaces and tapered sections. It also supports inner diameter grinding through attachment replacement.
- Wafer processing/polishing equipment
Inexpensive and high-quality 2, 3, and 4-way solenoid valves.
- Other semiconductor manufacturing equipment
- Other electronic parts
Semiconductor device _ housing
- Semiconductor inspection/test equipment
Completely lead-free! A general-purpose flap wheel that can accommodate a wide range of applications.
- Wafer processing/polishing equipment
Over 2000 units sold! Easy-to-install simple grinding machine for small lot production.
- Other surface treatment equipment
- Wafer processing/polishing equipment
Introducing deburring machines for sheet metal workers pursued by Kanaya, including compact and handy types.
- Other surface treatment equipment
- Wafer processing/polishing equipment
The original polishing material "NF Wheel" is a polishing wheel suitable for intermediate finishing.
- Wafer processing/polishing equipment
Original abrasive material "GF Wheel" - the high-density blade tips create an astonishing grinding power.
- Other abrasives
- Wafer processing/polishing equipment
The original abrasive material "NS Wheel" exhibits a floating effect even in cases of excessive pressure.
- Wafer processing/polishing equipment
Original polishing material "SS Wheel," a versatile and easy-to-use standard type polishing wheel.
- Wafer processing/polishing equipment
Leap into the 21st century with comprehensive engineering in mechatronics.
- Other inspection equipment and devices
- Other semiconductor manufacturing equipment
- Other assembly machines
Introduction of various processing examples of picosecond UV laser processing machines.
- Other semiconductor manufacturing equipment
Industry-leading fast pressure calibrator. Modular design reduces line downtime and lowers equipment costs.
- Other FA equipment
- Other semiconductor manufacturing equipment
- Pressure
Notice of JCSS Calibration for Pressure Equipment
Since July 2022, our JCSS Calibration Center has expanded the calibration range and improved the calibration measurement capabilities of digital pressure gauges under the Measurement Law Traceability System (JCSS). By expanding the calibration range, we are now able to offer a wider range of JCSS calibration services, including inspections of our gas pressure products. We encourage you to take advantage of JCSS calibration at the manufacturer. 〇 Expansion of Digital Pressure Gauge Calibration Range Gas Gauge Pressure (Positive Pressure): 5 to 7000 kPa (Before Expansion: 70 to 2000 kPa) Gas Gauge Pressure (Negative Pressure): -95 to -5 kPa (Before Expansion: -95 to -20 kPa) Gas Absolute Pressure: 5 to 350 kPa (Before Expansion: 75 to 115 kPa) 〇 Issuance of JCSS calibration certificates in English is also supported. 〇 Please consult us regarding digital pressure gauges from other manufacturers. Nihon Baker Hughes Co., Ltd. 4-16-13 Tsukishima, Chuo-ku, Tokyo 104-0052 Service Department, Drilling Business Division Phone: 03-6894-1838
Various high-precision pressure sensors necessary for flow control in semiconductor manufacturing equipment. Customization of modules is also possible.
- Semiconductor inspection/test equipment
- Etching Equipment
- Sputtering Equipment
Would you like to introduce the pressure controller PACE for measurement testing/line inspection of semiconductor manufacturing equipment and MEMS pressure sensors?
- Semiconductor inspection/test equipment
- Etching Equipment
- Sputtering Equipment
Would you like to introduce the PACE series for pressure calibration testing on the manufacturing line? It is also possible to reduce production costs!
- Etching Equipment
- Sputtering Equipment
- Pressure
Wafer size post-process projection exposure equipment MRS adopts UV-LED light source as the standard light source (enabling reduction of running costs without sacrificing productivity!)
- Stepper
Processing technology that can polish shafts with complex shapes!
- Wafer processing/polishing equipment
For home appliance parts! Achieving work improvement, labor saving, and uniform product quality through automation.
- Wafer processing/polishing equipment
- Articulated Robot
Improving the precision and efficiency of MEMS processing! We will introduce high-precision etching and film deposition technologies. *Held from April 16 to April 17.
- Etching Equipment
"MEMS Engineer Forum 2025" - Announcement of Technical Exhibitions
We will be exhibiting at the technical exhibition corner of the "MEMS Engineer Forum 2025" to be held from April 16 to 17, 2025. <Exhibition Contents> 1. Introduction of low-temperature, low-damage etching and cleaning equipment using high-density radicals. Our patented HDRF technology eliminates yield issues in MEMS. 2. Introduction of processing technology (ion beam etching) essential for future high-frequency devices and high-speed optical modulation waveguide processing. Ion beam etching is optimal for processing multilayer structures, allowing for angle adjustment of the processing surface and roughness adjustment of sidewalls. 3. Introduction of plasma etching and film deposition equipment suitable for batch processing of compound semiconductors. Multiple wafers can be loaded onto a "shuttle" (wafer carrier) for batch processing. This equipment is suitable for small-scale production. We look forward to your visit.
Multi-layer film formation enables the improvement of load-bearing capacity for low-temperature DLC (Diamond-like carbon) thin film hard coatings!
- Plasma surface treatment equipment
- Surface treatment contract service
- Other semiconductor manufacturing equipment
It is now possible to achieve low-temperature DLC (Diamond-like carbon) thin film hard coatings with improved adhesion compared to conventional ta-C!
- Plasma surface treatment equipment
- Surface treatment contract service
- Other semiconductor manufacturing equipment
Multi-layer film formation enables the creation of low-temperature DLC (Diamond-like carbon) thin film hard coatings with improved impact resistance!
- Plasma surface treatment equipment
- Surface treatment contract service
- Other semiconductor manufacturing equipment