List of Semiconductors and ICs products
- classification：Semiconductors and ICs
886～900 item / All 4810 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Ultra-hard alloy rings for bearings that achieve micron-level precision.
- Other Auto Parts
- Other semiconductors
- Processing Jig
Supporting semiconductor manufacturing with micron to sub-micron precision grinding technology!
- Other Auto Parts
- Other semiconductors
- Processing Jig
Support for improving connector quality with micron to sub-micron precision grinding technology!
- Other Auto Parts
- Other semiconductors
- Processing Jig
Micron to submicron precision! Contributing to the miniaturization and high performance of medical devices.
- Other Auto Parts
- Other semiconductors
- Processing Jig
Achieved a high-speed cycle time and access time of 35ns! For replacing SRAM with battery backup.
- Memory
Solderable heat sink for surface mount devices measuring W13.5mm x H15.24mm x L19mm.
- Other semiconductors
Heat sink for surface mount devices measuring W8mm x H6mm x L8mm.
- Other semiconductors
High-frequency, high-current module contributing to the improvement of EV charging efficiency.
- diode
If you have challenges with streamlining wet processes or saving space, this is a must-see. We are currently offering materials that introduce an overview of process integration technology.
- Other semiconductor manufacturing equipment
- Resist Device
- Wafer
Chemical reactions caused by dilute gases can also be considered!
- CVD Equipment
- Wafer
- Other semiconductors
Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!
- Technical and Reference Books
- Other semiconductors
8/5 Webinar: Semiconductor Packaging Technology Course
■Title "Changes in Joint Structures and Packaging Responses Due to the Evolution of Semiconductors ~ Response of Resin Sealing Technology to the Increase in the Number of Joints and Narrow Pitching ~" In semiconductor packages, which are advancing in high integration, high density, and three-dimensionality, addressing the increase in joints (bumps) and narrowing of pitches has become an important challenge. In this seminar, experienced instructors will organize the changes in joint structures accompanying the evolution of semiconductor packages and explain the latest trends, challenges, and countermeasures in resin sealing technology and mounting technology. 【Knowledge Gained from the Seminar】 - Development history and latest trends of semiconductor packaging - Changes in joint structures and packaging technology - Evaluation methods for resin sealing materials and sealing technology - Sealing technology for narrow pitch bumps and reliability improvement - Challenges and countermeasures in advanced packaging 【Target Audience】 Engineers, researchers, and sales representatives from semiconductor-related companies, as well as those involved in semiconductor manufacturing, mounting, sealing materials, and packaging technology.
Aluminum heat sink for board mounting that can secure a transistor without screws (W15 mm x H45 mm)
- Other semiconductors
Supports chips smaller than 0.3mm! Next-generation manufacturing equipment designed for the miniaturization of electronic components!
- Wafer